XCV600E-6FG676I

IC FPGA 444 I/O 676FCBGA
Part Description

Virtex®-E Field Programmable Gate Array (FPGA) IC 444 294912 15552 676-BGA

Quantity 171 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case676-BGANumber of I/O444Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3456Number of Logic Elements/Cells15552
Number of Gates985882ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits294912

Overview of XCV600E-6FG676I – Virtex®-E Field Programmable Gate Array (FPGA) IC, 676-BGA

The XCV600E-6FG676I is a Virtex®-E family FPGA provided in a 676-ball FBGA (27×27) package, optimized for industrial applications. This SRAM-based, reprogrammable device combines a high logic element count with substantial I/O and embedded memory to support complex digital designs.

Key capabilities exposed by the device include a large number of logic elements, high I/O density, on-chip RAM, and support for advanced I/O signaling and clock management as documented for the Virtex‑E family.

Key Features

  • Programmable Core  Approximately 15,552 logic elements provide the configurable fabric required for complex control, signal processing, and glue-logic implementations.
  • Embedded Memory  Approximately 0.29 Mbits (294,912 bits) of on-chip RAM to support buffering, FIFOs, and small internal memory structures.
  • I/O Density and Bandwidth  444 user I/O pins offer high I/O concurrency for parallel interfaces and wide buses.
  • Advanced I/O and Differential Signaling  Family-level Virtex‑E technology supports SelectI/O+ interface options and differential standards such as LVDS, BLVDS, and LVPECL for high-speed serial and source-synchronous links.
  • Clock Management  The Virtex‑E family provides multiple fully digital Delay-Locked Loops (DLLs) for clock multiplication/division and duty-cycle control to support complex timing requirements.
  • Power and Interface Supply  Core supply range is specified from 1.71 V to 1.89 V, matching the 1.8 V Virtex‑E core specification.
  • Industrial Temperature Grade  Qualified for operation from −40 °C to 100 °C for reliable performance in industrial environments.
  • Package and Mounting  Supplied in a 676-FBGA (27×27) surface-mount package for compact board-level integration.
  • Manufacturing and Test  The device is factory tested and provided as an SRAM-based, in-system reprogrammable FPGA for iterative development and deployment.

Typical Applications

  • Industrial Control and Automation  Use the device’s industrial temperature rating and high I/O count for motor control, PLC I/O expansion, and real-time control logic.
  • High-Speed Interfaces and Networking  Leverage SelectI/O+ and differential signaling support for source-synchronous interfaces, protocol bridging, and custom packet processing.
  • Memory and Bus Interface Bridging  Embedded RAM and programmable logic enable custom buffering, arbitration, and interface adaptation between disparate memory and peripheral standards.
  • Prototyping and In-System Reconfiguration  SRAM-based reprogrammability supports iterative development, functional updates, and design validation without changing hardware.

Unique Advantages

  • High Logic Capacity: Approximately 15,552 logic elements provide the resources needed for medium-complexity FPGA designs without external glue logic.
  • Substantial I/O Count: 444 I/Os enable wide parallel buses and multiple concurrent interface channels on a single device.
  • On-Chip Memory: Approximately 0.29 Mbits of embedded RAM reduces dependence on external memory for small buffering and state storage.
  • Industrial Reliability: Rated for −40 °C to 100 °C operation to meet environmental demands of factory and fielded systems.
  • Flexible Clocking: Multiple DLLs and family clock-management features simplify clock domain control and DDR timing requirements.
  • Compact, Surface-Mount Package: 676-FBGA (27×27) packaging offers a dense solution for space-constrained PCBs.

Why Choose XCV600E-6FG676I?

The XCV600E-6FG676I positions itself as a versatile Virtex‑E family FPGA for engineers who need a balanced combination of logic capacity, I/O density, and embedded memory within an industrial temperature envelope. Its programmable core and on-chip resources make it suitable for designs requiring in-system reconfiguration and reliable operation across extended temperature ranges.

For teams implementing mid-range FPGA designs—such as industrial controllers, interface bridges, and high-speed I/O modules—this device offers a traceable specification set, compact package, and the reprogrammability advantages of SRAM-based FPGAs.

Request a quote for the XCV600E-6FG676I to check current availability and pricing for your next design.

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