XCV600E-6BG432C

IC FPGA 316 I/O 432MBGA
Part Description

Virtex®-E Field Programmable Gate Array (FPGA) IC 316 294912 15552 432-LBGA Exposed Pad, Metal

Quantity 511 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package432-MBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case432-LBGA Exposed Pad, MetalNumber of I/O316Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3456Number of Logic Elements/Cells15552
Number of Gates985882ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits294912

Overview of XCV600E-6BG432C – Virtex®-E Field Programmable Gate Array, 432-LBGA

The XCV600E-6BG432C is a Virtex®-E series Field Programmable Gate Array (FPGA) in a 432-ball LBGA exposed-pad metal package designed for commercial-grade, surface-mount applications. It delivers a high-density, reprogrammable logic fabric with a 1.8 V-class core (specified supply 1.71 V to 1.89 V) and is intended for designs requiring substantial I/O counts and embedded memory.

Typical use cases include high-performance interface controllers, memory subsystem logic, and complex custom digital functions where integration, reconfigurability and on-chip resources are important for reducing overall system complexity.

Key Features

  • Logic Capacity  Provides 15,552 logic elements (logic cells) and approximately 985,882 equivalent gates for implementing complex combinational and sequential logic.
  • Embedded Memory  Approximately 0.295 Mbits of on-chip RAM (294,912 total RAM bits) to support buffering, FIFOs and small on-chip data stores.
  • I/O Density & Flexibility  316 user I/O pins enable high pin-count designs and flexible interface routing for mixed-signal and high-speed I/O requirements.
  • Clock Management  Series-level clock management features include multiple fully digital delay-locked loops, enabling deterministic clocking and DDR-friendly timing architectures.
  • High-Speed Interface Support  Virtex®-E SelectI/O+ technology (series feature) provides broad interface standard support and differential signaling capabilities for high-bandwidth applications.
  • Package & Mounting  432-LBGA exposed pad, metal package (supplier package 432-MBGA, 40×40) delivered in a surface-mount form factor for compact board-level integration.
  • Power & Temperature  Core supply specified 1.71 V to 1.89 V and commercial operating temperature range 0 °C to 85 °C.
  • Compliance  RoHS compliant and 100% factory tested as part of the Virtex®-E family production specifications.

Typical Applications

  • High-performance interface bridging  Use for PCI-compliant and other bus-interface logic where flexible I/O and reprogrammability help implement complex protocol bridges and timing adaptations.
  • Memory controller and buffering  Leverage on-chip RAM and SelectRAM+ memory hierarchy features for interfacing to ZBT SRAMs and DDR SDRAMs and for high-bandwidth buffering.
  • High-speed serial and differential signaling  Implement LVDS/LVPECL/BLVDS and other differential interfaces supported by the Virtex®-E series for low-jitter clocking and high-rate data paths.
  • Reconfigurable system logic  Ideal for in-system programmable designs requiring field updates, prototyping, and deployment of custom digital accelerators or control logic.

Unique Advantages

  • Significant on-chip logic and gates: 15,552 logic elements and nearly one million equivalent gates enable dense implementation of custom logic with fewer external components.
  • Integrated memory resources: Approximately 0.295 Mbits of embedded RAM reduces dependence on external memory for small buffers and control structures.
  • High I/O count with flexible standards: 316 I/Os and SelectI/O+ series capabilities support a wide range of interface standards and differential signaling for system-level connectivity.
  • Deterministic clocking: Multiple digital DLLs (series feature) provide precise clock management for DDR and high-speed synchronous designs.
  • Compact, manufacturable package: 432-LBGA exposed-pad metal package in a 40×40 supplier footprint simplifies board placement and thermal conduction for surface-mount assembly.
  • Commercial-grade, RoHS compliant: Designed for commercial temperature operation (0 °C to 85 °C) and compliant with RoHS requirements for environmental compatibility.

Why Choose XCV600E-6BG432C?

The XCV600E-6BG432C combines a high logic element count, substantial gate-equivalent capacity and on-chip memory with a large, flexible I/O complement in a compact LBGA package—making it well suited for designers building high-performance, reconfigurable digital systems. Its 1.8 V-class core and series-level features for high-speed interfaces and clock management support demanding timing and bandwidth requirements while enabling in-system programmability.

This device is suited for engineering teams and procurement seeking a commercially graded FPGA for communications, memory interface, prototyping, or custom logic accelerator roles where integration, reprogrammability and proven family-level capabilities are key selection criteria.

Request a quote or submit a pricing and availability inquiry to begin specifying XCV600E-6BG432C for your next design.

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