XCV600E-7HQ240C

IC FPGA 158 I/O 240QFP
Part Description

Virtex®-E Field Programmable Gate Array (FPGA) IC 158 294912 15552 240-BFQFP Exposed Pad

Quantity 1,261 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeCommercialOperating Temperature0°C – 85°C
Package / Case240-BFQFP Exposed PadNumber of I/O158Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3456Number of Logic Elements/Cells15552
Number of Gates985882ECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits294912

Overview of XCV600E-7HQ240C – Virtex®‑E FPGA, 240‑BFQFP Exposed Pad

The XCV600E-7HQ240C is a Virtex®-E field programmable gate array (FPGA) offered in a 240‑BFQFP exposed pad package. It delivers a balance of programmable logic, embedded memory, and I/O resources for commercial electronic designs requiring reconfigurable logic and high I/O density.

Built on the Virtex‑E family architecture, this device provides a substantial logic resource set, on-chip memory, and a broad supply/temperature operating window—making it suitable for commercial systems that need customizable logic, high channel counts, and standard surface-mount packaging.

Key Features

  • Logic Capacity — 15,552 logic elements and 3,456 CLBs provide ample programmable fabric for complex custom logic implementations.
  • Embedded Memory — Approximately 0.295 Mbits (294,912 bits) of on-chip RAM to support buffering, FIFOs, and local storage.
  • I/O Resource — 158 general-purpose I/O pins to connect with peripherals, external memories, and board-level interfaces.
  • Gate Count — 985,882 system gates giving designers a clear metric for gate-equivalent complexity.
  • Power and Supply — Core supply range of 1.71 V to 1.89 V, aligning with 1.8 V-class FPGA operation for low-voltage designs.
  • Package & Mounting — 240‑BFQFP exposed pad (supplier device package: 240‑PQFP 32×32) for surface-mount assembly and thermal conduction through the exposed pad.
  • Commercial Temperature Grade — Specified to operate from 0 °C to 85 °C for commercial applications.
  • Standards & Family Features — As part of the Virtex‑E family, the device benefits from family-level features such as high-performance I/O technology, built-in clock management (DLLs), and an internal memory hierarchy described in the Virtex‑E product documentation.
  • RoHS Compliant — Meets RoHS environmental standards for lead-free assembly.

Typical Applications

  • High-speed interface logic — Implement custom protocol bridges and interface logic where numerous I/Os and programmable timing are required.
  • Embedded compute and control — Use the FPGA fabric and on-chip memory for real-time control, signal processing, and state-machine implementations in commercial equipment.
  • Memory interface and buffering — Leverage on-chip RAM to implement buffering, FIFOs, or local scratch memory for external memory controllers and data-path staging.

Unique Advantages

  • Substantial programmable resources: 15,552 logic elements enable integration of complex functions into a single device, reducing board-level component count.
  • Significant embedded RAM: Approximately 0.295 Mbits of on-chip memory supports local buffering and reduces reliance on external memory for many applications.
  • Flexible I/O density: 158 I/O pins accommodate a wide range of peripherals and interfaces without additional I/O expanders.
  • Standard surface-mount package: 240‑BFQFP exposed pad provides a production-ready footprint with improved thermal path for PCB assembly.
  • Commercial-ready operating range: Rated 0 °C to 85 °C and RoHS compliant for mainstream commercial product deployments.

Why Choose XCV600E-7HQ240C?

The XCV600E-7HQ240C combines a mature Virtex‑E family architecture with a significant logic and memory footprint in a production-friendly 240‑BFQFP exposed pad package. Its 15,552 logic elements, substantial on-chip RAM, and 158 I/Os make it well suited for commercial systems that require reprogrammable logic, custom data-paths, and flexible interfacing while maintaining standard surface-mount assembly practices.

This device is suited to design teams targeting commercial-grade products that need scalable, reconfigurable logic with proven family-level features documented for the Virtex‑E series. The combination of logic capacity, embedded memory, and robust I/O resources helps simplify board-level design and supports longer-term design iterations through reprogramming.

Request a quote or submit pricing and availability inquiries to begin integrating the XCV600E-7HQ240C into your next commercial design project.

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