XCV600E-7FG900I

The XCV600E-7FG900I is a Virtex®-E family Field Programmable Gate Array (FPGA) offered in a 900-ball BGA package for surface-mount applications. It provides a mix of programmable logic, embedded memory, and high-density I/O to support system-level functions such as high-performance interfaces, memory controllers, and custom logic acceleration.

Designed for industrial environments, this device combines a 1.71–1.89 V core supply range, broad I/O capability with 512 pins, and an operating temperature range from −40 °C to 100 °C to meet demanding embedded and systems-level applications.

Key Features

• Programmable Logic – 15,552 logic elements and approximately 985,882 gates provide the capacity to implement complex digital functions and custom processing pipelines.
• On‑chip Memory – Approximately 294,912 bits of embedded RAM (approximately 0.295 Mbits) to support FIFOs, buffers, and tightly coupled memory structures inside designs.
• I/O Capacity and SelectI/O+ Support – 512 I/O pins supporting a wide range of interface options and high aggregate bandwidth for system-level signal routing and protocol bridging.
• Differential Signalling and High‑Speed Interfaces – Series-level support for LVDS, BLVDS, and LVPECL differential signaling and up to PCI-compliant 3.3 V 32/64-bit 33/66-MHz operation as documented for the Virtex‑E family.
• Clock and Timing Resources – Family-level clock management includes multiple digitally controlled delay-locked loops (DLLs) and features for clock multiplication/division and stable DDR timing support.
• Configuration and Process – SRAM-based in-system reprogrammability with production-grade 0.18 μm process technology and 100% factory testing for consistent device delivery.
• Package and Mounting – Surface-mount 900-BBGA package (supplier device package: 900-FBGA, 31×31 mm) for compact board integration.
• Power and Temperature – Core supply range of 1.71 V to 1.89 V and industrial operating temperature range from −40 °C to 100 °C for robust field operation.
• Environmental Compliance – RoHS compliant.

Typical Applications

• High‑speed Interface Bridging – Implement PCI and other high-bandwidth interfaces using the device’s extensive I/O and differential signaling support to bridge between system buses and custom logic.
• Memory Interface and Controllers – Build controllers for external memories and buffering logic leveraging the embedded RAM and family-level support for DDR and synchronous SRAM interfaces.
• Custom Data Processing – Deploy parallel processing pipelines, protocol parsing, and hardware acceleration using the device’s abundant logic elements and on-chip memory.
• Industrial Control and Communication – Use the industrial temperature rating and extensive I/O to implement control engines, protocol converters, and field communications in industrial systems.

Unique Advantages

• Balance of Logic and Memory: The combination of 15,552 logic elements and approximately 0.295 Mbits of embedded RAM enables integrated designs that reduce external component count.
• Broad I/O Flexibility: 512 I/Os with family-level SelectI/O+ technology and differential signaling options allow straightforward integration with diverse interface standards.
• Industrial‑Grade Operation: Rated for −40 °C to 100 °C operation and RoHS compliant for deployment in industrial applications.
• Field Reprogrammability: SRAM-based in-system configuration permits design updates and iterative development without hardware changes.
• Compact, Surface‑Mount Packaging: 900-BBGA (900-FBGA 31×31) provides a high-density mounting solution for space-constrained boards.

Why Choose XCV600E-7FG900I?

The XCV600E-7FG900I positions itself as a versatile Virtex‑E FPGA option for designs requiring a strong mix of programmable logic, embedded RAM, and extensive I/O in an industrial-capable package. Its documented family features—differential signaling support, clock management resources, and in-system reprogrammability—combined with the device’s specific capacities (15,552 logic elements, ~0.295 Mbits RAM, 512 I/O) make it well suited for system interface logic, memory controllers, and custom acceleration blocks.

Choose this device when you need a proven FPGA architecture with production-tested silicon, compact BGA packaging, and the ability to adapt firmware and hardware behavior in the field while operating across a wide industrial temperature and core-voltage range.

Request a quote or submit your requirements to begin procurement and evaluation of the XCV600E-7FG900I for your next design.