XCV600E-8FG676C

IC FPGA 444 I/O 676FCBGA
Part Description

Virtex®-E Field Programmable Gate Array (FPGA) IC 444 294912 15552 676-BGA

Quantity 64 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case676-BGANumber of I/O444Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3456Number of Logic Elements/Cells15552
Number of Gates985882ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits294912

Overview of XCV600E-8FG676C – Virtex®-E 1.8 V FPGA, 676-BGA

The XCV600E-8FG676C is a Virtex®-E field programmable gate array (FPGA) from AMD in a 676-ball BGA package. It delivers a balance of logic capacity, on-chip memory and high-density I/O for demanding commercial embedded and communications designs. This device is targeted at applications that require substantial programmable logic (15,552 logic elements), extensive I/O (444 pins), and on-chip embedded memory (approximately 0.295 Mbits).

Key Features

  • Core Logic — 15,552 logic elements and approximately 985,882 equivalent gates provide substantial programmable fabric for complex logic and control functions.
  • Embedded Memory — Approximately 0.295 Mbits (294,912 bits) of on-chip RAM suitable for buffering, FIFOs and local data storage.
  • I/O and Interfaces — 444 user I/Os available in the 676-BGA package for wide connectivity. Virtex‑E family SelectI/O+ technology supports many high‑performance interface standards and differential signalling options.
  • Clocking and Timing — Family-level clock-management features include multiple digital delay‑locked loops (DLLs) and support for DDR and high-speed LVDS/LVPECL clocking as described in the Virtex‑E specification.
  • Package and Mounting — 676-FBGA (27×27) surface-mount package (676-BGA) for high-density board designs and reliable solder attachment.
  • Power and Supply — Internal core voltage supply specified at 1.71 V to 1.89 V (nominal 1.8 V) to match 1.8 V FPGA family power domains.
  • Operating Range — Commercial grade device rated for 0 °C to 85 °C ambient operation.
  • Configuration and Ecosystem (Family Capabilities) — SRAM-based in-system reprogrammability and family-level support for high-speed memory interfaces and synthesis tools as specified in the Virtex‑E documentation.
  • Regulatory — RoHS compliant.

Typical Applications

  • Telecommunications and Networking — High-density I/O and family support for differential and DDR interfaces make the device suitable for protocol bridging, packet processing, and front-end interface logic.
  • High-Speed Data Acquisition — On-chip RAM and rich I/O coverage support buffering and aggregation of multiple high-rate data streams.
  • Embedded Control and Signal Processing — Logic capacity and internal memory enable custom datapaths, finite-state machines, and preprocessing for higher-level processors.
  • Memory Interface Logic — Family features target high-performance external memory interfaces and timing-critical glue logic between memory and system components.

Unique Advantages

  • Substantial Logic Density: 15,552 logic elements and nearly one million equivalent gates provide the headroom for complex designs without immediate need for external ASICs.
  • Comprehensive I/O Resources: 444 I/Os in a compact 676-BGA allow broad peripheral and high-speed interface support while minimizing board area.
  • On-Board Memory for Low-Latency Tasks: Approximately 0.295 Mbits of embedded RAM reduces dependency on external memory for buffering and real‑time processing.
  • 1.8 V Core with Standard Commercial Range: Specified 1.71–1.89 V core supply and 0 °C–85 °C operating range fit mainstream commercial applications and system power architectures.
  • SRAM-Based Reprogrammability: In-system configuration enables iterative development, field updates and design flexibility during product lifecycles.

Why Choose XCV600E-8FG676C?

The XCV600E-8FG676C brings a mature Virtex‑E FPGA architecture into compact, surface-mount packaging that balances logic capacity, embedded RAM and wide I/O count for demanding commercial applications. Its 1.8 V core, commercial temperature rating and RoHS compliance make it appropriate for embedded systems, communications modules and data handling logic that require reprogrammability and in-field updates.

This device suits engineering teams who need scalable programmable logic with on-chip memory and extensive I/O, backed by the Virtex‑E family’s documented clocking, differential signalling and memory-interface features. It supports iterative development and long-term design flexibility through SRAM-based configuration.

Request a quote for XCV600E-8FG676C to check current availability and pricing or to submit a procurement inquiry.

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