XCV800-4BG432I
| Part Description |
Virtex® Field Programmable Gate Array (FPGA) IC 316 114688 21168 432-LBGA Exposed Pad, Metal |
|---|---|
| Quantity | 204 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 432-MBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 432-LBGA Exposed Pad, Metal | Number of I/O | 316 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4704 | Number of Logic Elements/Cells | 21168 | ||
| Number of Gates | 888439 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 114688 |
Overview of XCV800-4BG432I – Virtex® FPGA, 21,168 Logic Elements, 432-LBGA
The XCV800-4BG432I is an SRAM-based Virtex Field Programmable Gate Array (FPGA) IC offered in a 432-LBGA exposed pad metal package. It delivers a high-density programmable logic fabric with 21,168 logic elements and approximately 0.115 Mbits of embedded RAM, suited for industrial-grade embedded and system applications that require reprogrammable logic, flexible I/O, and on-chip memory.
Architecture and family-level features include multi-standard SelectIO interfaces, hierarchical memory resources, and built-in clock-management circuitry—making the device applicable for compute, interface bridging, and system-control tasks within its specified voltage and temperature ranges.
Key Features
- Logic Capacity 21,168 logic elements (cells) providing high-density programmable logic for complex designs.
- Embedded Memory Approximately 0.115 Mbits (114,688 bits) of on-chip RAM with LUTs configurable as 16-bit/32-bit RAM, dual-ported RAM, or shift registers, plus configurable 4k-bit dual-ported RAM blocks.
- I/O 316 user I/O pins supporting multi-standard SelectIO™ interfaces and 16 high-performance interface standards for flexible external device connectivity.
- Clock Management Built-in clock-management features including four dedicated delay-locked loops (DLLs), four primary low-skew global clock distribution nets, and multiple secondary local clock nets for advanced timing control.
- Arithmetic & Logic Support Dedicated carry logic, multiplier support, and cascade chains for efficient implementation of high-speed arithmetic and wide-input functions.
- Configuration & Re-programmability SRAM-based in-system configuration with multiple programming modes enabling unlimited re-programmability.
- Package & Mounting 432-LBGA exposed pad, metal package (supplier package: 432-MBGA 40×40) designed for surface-mount assembly.
- Power & Temperature Supply voltage range 2.375 V to 2.625 V; operating temperature range −40 °C to 100 °C; industrial grade.
- Reliability & Test 100% factory tested; includes IEEE 1149.1 boundary-scan logic and a die-temperature sensor diode for board-level diagnostics.
Typical Applications
- Embedded Systems Implement custom control logic, protocol bridging, or hardware acceleration where reprogrammability and on-chip memory reduce external component count.
- Communications Interfaces Use the multi-standard SelectIO and flexible clocking resources to implement interface conversion, buffering, and timing-critical link logic.
- Industrial Control Deploy in industrial-grade control systems requiring operation across −40 °C to 100 °C and a compact surface-mount package.
- Prototype and In-System Reconfiguration Leverage SRAM-based configuration for iterative development, firmware updates, and field reprogramming without hardware changes.
Unique Advantages
- High logic density: 21,168 logic elements enable consolidation of complex logic into a single device, reducing board-level integration effort.
- Flexible on-chip memory: Approximately 0.115 Mbits of embedded RAM with multiple LUT-RAM and dual-ported configurations simplifies data buffering and state storage.
- Advanced clocking: Four DLLs and multiple global/local clock nets provide granular timing control for synchronous designs and high-performance data paths.
- Industrial-ready thermal range: Rated for −40 °C to 100 °C operation, supporting deployment in rugged environments.
- Surface-mount, thermally enhanced package: 432-LBGA exposed pad metal package supports compact board layouts and thermal conduction for power-dense designs.
- Proven development ecosystem: Supported by FPGA Foundation and Alliance development systems for design, synthesis, and place-and-route workflows.
Why Choose XCV800-4BG432I?
The XCV800-4BG432I positions itself as a high-density, industrial-grade FPGA option for engineers who need reprogrammable logic with integrated memory, flexible I/O, and mature clock-management features. Its combination of logic capacity, on-chip RAM, and dedicated arithmetic resources makes it suitable for designs that consolidate multiple discrete functions into a single programmable device.
Backed by factory testing and established development tool support, this Virtex device offers a path for scalable designs that require in-system reconfiguration, robust timing control, and reliable operation across a wide temperature range.
Request a quote or submit an inquiry to receive pricing and availability information for the XCV800-4BG432I.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








