XCV800-4BG432I

IC FPGA 316 I/O 432MBGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 316 114688 21168 432-LBGA Exposed Pad, Metal

Quantity 204 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package432-MBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case432-LBGA Exposed Pad, MetalNumber of I/O316Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4704Number of Logic Elements/Cells21168
Number of Gates888439ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits114688

Overview of XCV800-4BG432I – Virtex® FPGA, 21,168 Logic Elements, 432-LBGA

The XCV800-4BG432I is an SRAM-based Virtex Field Programmable Gate Array (FPGA) IC offered in a 432-LBGA exposed pad metal package. It delivers a high-density programmable logic fabric with 21,168 logic elements and approximately 0.115 Mbits of embedded RAM, suited for industrial-grade embedded and system applications that require reprogrammable logic, flexible I/O, and on-chip memory.

Architecture and family-level features include multi-standard SelectIO interfaces, hierarchical memory resources, and built-in clock-management circuitry—making the device applicable for compute, interface bridging, and system-control tasks within its specified voltage and temperature ranges.

Key Features

  • Logic Capacity  21,168 logic elements (cells) providing high-density programmable logic for complex designs.
  • Embedded Memory  Approximately 0.115 Mbits (114,688 bits) of on-chip RAM with LUTs configurable as 16-bit/32-bit RAM, dual-ported RAM, or shift registers, plus configurable 4k-bit dual-ported RAM blocks.
  • I/O  316 user I/O pins supporting multi-standard SelectIO™ interfaces and 16 high-performance interface standards for flexible external device connectivity.
  • Clock Management  Built-in clock-management features including four dedicated delay-locked loops (DLLs), four primary low-skew global clock distribution nets, and multiple secondary local clock nets for advanced timing control.
  • Arithmetic & Logic Support  Dedicated carry logic, multiplier support, and cascade chains for efficient implementation of high-speed arithmetic and wide-input functions.
  • Configuration & Re-programmability  SRAM-based in-system configuration with multiple programming modes enabling unlimited re-programmability.
  • Package & Mounting  432-LBGA exposed pad, metal package (supplier package: 432-MBGA 40×40) designed for surface-mount assembly.
  • Power & Temperature  Supply voltage range 2.375 V to 2.625 V; operating temperature range −40 °C to 100 °C; industrial grade.
  • Reliability & Test  100% factory tested; includes IEEE 1149.1 boundary-scan logic and a die-temperature sensor diode for board-level diagnostics.

Typical Applications

  • Embedded Systems  Implement custom control logic, protocol bridging, or hardware acceleration where reprogrammability and on-chip memory reduce external component count.
  • Communications Interfaces  Use the multi-standard SelectIO and flexible clocking resources to implement interface conversion, buffering, and timing-critical link logic.
  • Industrial Control  Deploy in industrial-grade control systems requiring operation across −40 °C to 100 °C and a compact surface-mount package.
  • Prototype and In-System Reconfiguration  Leverage SRAM-based configuration for iterative development, firmware updates, and field reprogramming without hardware changes.

Unique Advantages

  • High logic density: 21,168 logic elements enable consolidation of complex logic into a single device, reducing board-level integration effort.
  • Flexible on-chip memory: Approximately 0.115 Mbits of embedded RAM with multiple LUT-RAM and dual-ported configurations simplifies data buffering and state storage.
  • Advanced clocking: Four DLLs and multiple global/local clock nets provide granular timing control for synchronous designs and high-performance data paths.
  • Industrial-ready thermal range: Rated for −40 °C to 100 °C operation, supporting deployment in rugged environments.
  • Surface-mount, thermally enhanced package: 432-LBGA exposed pad metal package supports compact board layouts and thermal conduction for power-dense designs.
  • Proven development ecosystem: Supported by FPGA Foundation and Alliance development systems for design, synthesis, and place-and-route workflows.

Why Choose XCV800-4BG432I?

The XCV800-4BG432I positions itself as a high-density, industrial-grade FPGA option for engineers who need reprogrammable logic with integrated memory, flexible I/O, and mature clock-management features. Its combination of logic capacity, on-chip RAM, and dedicated arithmetic resources makes it suitable for designs that consolidate multiple discrete functions into a single programmable device.

Backed by factory testing and established development tool support, this Virtex device offers a path for scalable designs that require in-system reconfiguration, robust timing control, and reliable operation across a wide temperature range.

Request a quote or submit an inquiry to receive pricing and availability information for the XCV800-4BG432I.

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