XCV800-4BG560C

The XCV800-4BG560C is a high-capacity Virtex® SRAM-based Field Programmable Gate Array provided by AMD. It combines large programmable logic resources with on-chip memory and flexible I/O in a 560-LBGA exposed pad package, targeting high-performance programmable-logic system designs.

Its architecture and feature set support applications requiring significant logic density, extensive I/O, and on-chip RAM, while offering in-system reprogrammability and comprehensive clock management for complex digital designs.

Key Features

• Logic Capacity — 21,168 logic elements and approximately 888,439 system gates provide substantial combinational and sequential logic resources for complex designs.
• Embedded Memory — 114,688 total RAM bits (approximately 0.11 Mbits of embedded memory) for data buffering, FIFOs, and small on-chip storage.
• I/O and Package — 404 user I/O pins in a 560-LBGA exposed pad metal package; supplier device package listed as 560-MBGA (42.5×42.5 mm). Surface-mount mounting type.
• Power & Operating Range — Core supply range of 2.375 V to 2.625 V and a commercial operating temperature range of 0 °C to 85 °C.
• Clock Management — Built-in clock-management circuitry including four dedicated delay-locked loops (DLLs), four primary low-skew global clock nets, and 24 secondary local clock nets to support complex timing domains.
• Multi-standard SelectIO — Support for multi-standard SelectIO interfaces and multiple high-performance interface standards for flexible external device connectivity.
• Hierarchical Memory & Logic Flexibility — LUTs configurable as multiple RAM and shift-register modes, dedicated carry logic and multiplier support, and abundant registers with clock enable and synchronous/asynchronous set/reset.
• SRAM-based In-System Configuration — SRAM configuration enables unlimited re-programmability and four programming modes for field updates and iterative development.
• Process & Quality — Built on a 0.22 μm, 5-layer-metal CMOS process and 100% factory tested.
• Standards & Compatibility — Series-level features include system performance up to 200 MHz and 66-MHz PCI compliance; supported by the vendor’s development tool ecosystems.
• RoHS Compliance — Device is RoHS compliant.

Typical Applications

• System Prototyping and ASIC Replacement — High logic capacity and reprogrammability make the device suitable for replacing or prototyping mask-programmed gate arrays.
• High-performance I/O and Interface Bridging — Multi-standard SelectIO and 404 I/O pins support complex interface bridging and connectivity tasks, including PCI-related designs at the series level.
• Clock-Critical Designs — Integrated DLLs and multiple global/local clock nets enable precise clocking for timing-sensitive logic and synchronous subsystems.
• Memory-centric Logic Functions — On-chip RAM and configurable LUT RAM modes support embedded buffering, FIFOs, and customized memory structures.
• Compact PCI and Hot-Swap Systems — Series-level support for hot-swappable Compact PCI applications and system integration scenarios.

Unique Advantages

• High integration of logic and gates: 21,168 logic elements and ~888,439 gates reduce the need for multiple discrete devices in large designs.
• Extensive I/O in a compact package: 404 I/O pins in a 560-LBGA package simplify board-level routing for dense interface requirements.
• Flexible on-chip memory: 114,688 RAM bits and LUT-configurable memory modes enable efficient implementation of custom memory structures without external RAM.
• Robust clocking options: Four DLLs and multiple clock distribution nets support multi-domain timing and low-skew clock distribution.
• Field reprogrammability: SRAM-based configuration with unlimited re-programmability enables iterative development and in-field updates.
• Proven silicon and testing: 0.22 μm, 5-layer-metal process and 100% factory testing contribute to predictable manufacturing quality.

Why Choose XCV800-4BG560C?

The XCV800-4BG560C positions itself for designers who need substantial programmable logic, flexible on-chip memory, and numerous I/O in a single, surface-mount LBGA package. Its SRAM-based architecture and comprehensive clock-management resources support complex timing and reconfiguration needs throughout development and deployment.

With series-level support from established FPGA development toolflows and a manufacturing process designed for density and performance, this device is suited for teams building high-capacity, reprogrammable digital systems within a commercial temperature range.

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