XCV800-5BG560I

IC FPGA 404 I/O 560MBGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 404 114688 21168 560-LBGA Exposed Pad, Metal

Quantity 841 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package560-MBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case560-LBGA Exposed Pad, MetalNumber of I/O404Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4704Number of Logic Elements/Cells21168
Number of Gates888439ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits114688

Overview of XCV800-5BG560I – Virtex® Field Programmable Gate Array, 560-LBGA

The XCV800-5BG560I is a high-density Virtex® SRAM-based FPGA in a 560-ball LBGA package with exposed pad metal. It combines a large logic fabric with embedded memory and extensive I/O to support complex, reprogrammable system designs in industrial environments.

Built on the Virtex architecture, this device targets applications that require substantial logic capacity, flexible on-chip memory, multi-standard I/O, and reliable clock management while operating across an industrial temperature range.

Key Features

  • Logic Capacity — Approximately 21,168 logic elements and 888,439 system gates provide significant on-chip programmable logic for complex designs.
  • Embedded Memory — 114,688 total RAM bits (approximately 114.7 Kbits) of on-chip memory with LUTs configurable as various RAM and shift-register modes to support hierarchical memory architectures.
  • I/O and Interface Support — 404 user I/O pins with multi-standard SelectIO™ interfaces and fast interfaces to external high-performance RAMs for flexible connectivity.
  • Clocking and Timing — Four dedicated delay-locked loops (DLLs), multiple global and local clock distribution nets for advanced clock control and low-skew distribution.
  • Configuration and Reprogrammability — SRAM-based in-system configuration with unlimited re-programmability and four programming modes for flexible deployment and updates.
  • Package and Thermal — 560-LBGA exposed pad, metal package (560-MBGA, 42.5 × 42.5 mm) designed for surface-mount assembly; specified operating temperature range −40 °C to 100 °C.
  • Power and Supply — Supports supply voltage range of 2.375 V to 2.625 V to match board-level power architectures.
  • Manufacturing and Process — Implemented in a 0.22 μm, 5-layer metal CMOS process and 100% factory tested; RoHS compliant.

Typical Applications

  • PCI and Compact PCI systems — Suitable for designs requiring 66-MHz PCI compliance and hot-swappable Compact PCI capability.
  • High-performance system logic — Large logic capacity and dedicated arithmetic resources support compute-intensive custom logic and algorithm acceleration.
  • Memory and interface bridging — Configurable LUT RAM and fast external RAM interfaces enable memory-dense functions and protocol bridging to high-performance memories.
  • Reconfigurable in-system designs — SRAM-based architecture and unlimited re-programmability allow field updates and iterative development workflows.

Unique Advantages

  • High logic density: With roughly 21,168 logic elements and 888,439 system gates, the device supports large, complex designs without immediate external logic.
  • Flexible embedded memory: 114,688 bits of RAM and configurable LUT modes provide multiple on-chip memory options for buffering, FIFOs, and local storage.
  • Advanced clock management: Four DLLs and hierarchical clock nets enable precise timing control for high-speed synchronous designs.
  • Extensive I/O capability: 404 I/O pins and multi-standard SelectIO support simplify interfacing to diverse peripherals and memory devices.
  • Industrial temperature range: Rated for −40 °C to 100 °C operation, supporting deployment in temperature-challenging environments.
  • Proven silicon and testing: 0.22 μm, 5-layer-metal process with 100% factory testing and RoHS compliance for consistent manufacturing quality.

Why Choose XCV800-5BG560I?

The XCV800-5BG560I is positioned for designs that require a balance of high logic capacity, flexible embedded memory, and robust I/O in a reprogrammable FPGA fabric. Its combination of substantial logic resources, clock-management features, and multi-standard I/O support makes it well-suited for industrial-grade systems that need in-field configurability and reliable operation across a wide temperature range.

For engineering teams building complex, reconfigurable hardware—such as PCI/Compact PCI systems, memory-intensive accelerators, or multi-interface controllers—this device offers a proven architecture and manufacturing pedigree that supports iterative development and long-term deployment.

Request a quote or submit a sales inquiry to obtain pricing, availability, and assistance integrating the XCV800-5BG560I into your next design.

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