XCVU080-3FFVA2104E

The XCVU080-3FFVA2104E is a Virtex® UltraScale™ Field Programmable Gate Array (FPGA) IC designed for high-capacity, board-mounted applications. This device provides approximately 975,000 logic elements, roughly 51.2 Mbits of embedded memory, and 832 I/O pins in a 2104-ball FCBGA package.

Packaging and electrical characteristics include a 2104-FCBGA (47.5 × 47.5 mm) supplier package, surface-mount mounting, a core voltage range of 970 mV to 1.03 V, and an operating temperature range of 0 °C to 100 °C. The device is RoHS compliant.

Key Features

• FPGA Family  Virtex® UltraScale™ architecture as indicated in the product name, providing the device's core FPGA functionality.
• Logic Capacity  Approximately 975,000 logic elements for high-density logic implementations.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM (51,200,000 bits) for buffering, FIFOs, and on-chip storage.
• I/O Count  832 available I/O pins to support extensive peripheral and interface connectivity.
• Package and Mounting  2104-BBGA / 2104-FCBGA package options; supplier package specified as 2104-FCBGA (47.5 × 47.5 mm). Surface-mount mounting type.
• Power  Core voltage supply range of 970 mV to 1.03 V to match system power design requirements.
• Environmental & Grade  Grade specified as Extended with an operating temperature range of 0 °C to 100 °C. RoHS compliant.

Unique Advantages

• High Logic Density: Approximately 975,000 logic elements enable large-scale digital designs and complex logic integration.
• Substantial On‑Chip RAM: Approximately 51.2 Mbits of embedded memory reduces dependence on external memory for intermediate buffering and local storage.
• Extensive I/O Resources: 832 I/O pins provide flexibility for interfacing with multiple peripherals, sensors, and high-speed links.
• Large FCBGA Package: The 2104-FCBGA (47.5 × 47.5 mm) package supports high pin counts and dense routing on board-level designs.
• Defined Power Envelope: A core voltage supply range of 970 mV to 1.03 V allows precise power budgeting during system design.
• Compliance and Mounting: Surface-mount package and RoHS compliance support modern PCB assembly processes and environmental requirements.

Why Choose XCVU080-3FFVA2104E?

The XCVU080-3FFVA2104E positions itself as a high-capacity Virtex® UltraScale™ FPGA option with a balanced combination of large logic resources, significant embedded memory, and a high I/O count in a 2104-ball FCBGA package. These characteristics make it suitable for designs that require dense logic implementation and substantial on-chip storage while maintaining a defined power and thermal envelope.

Manufactured by AMD and provided in a surface-mount FCBGA package, this device is intended for system designs that demand high integration and clear specification points for logic capacity, memory, I/O, power, and operating conditions.

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