XCVU095-2FFVB1760I

The XCVU095-2FFVB1760I is a Virtex® UltraScale™ Field Programmable Gate Array (FPGA) IC designed for industrial applications. It provides a high-density programmable fabric with 1,176,000 logic elements, approximately 62.26 Mbits of embedded memory, and 702 I/O, enabling complex logic integration and high-pin-count interfacing.

Packaged in a 1760-FCBGA (42.5 × 42.5 mm) surface-mount package and rated for an operating temperature range of −40°C to 100°C, this device targets robust, high-capacity designs that require significant on-chip resources and industrial-grade operating margins.

Key Features

• Core Logic 1,176,000 logic elements for implementing large-scale combinational and sequential logic designs.
• Embedded Memory Approximately 62.26 Mbits of on-chip RAM to support data buffering, FIFOs, and memory-intensive algorithms.
• High I/O Count 702 I/O pins to support dense external interfaces and multi-channel connectivity.
• Package & Mounting 1760-FCBGA (42.5 × 42.5 mm) package in a surface-mount form factor for board-level integration where high pin counts and thermal dissipation are required.
• Power Specified core voltage range from 922 mV to 979 mV for the device’s supply domain.
• Industrial Temperature Range Qualified to operate from −40°C to 100°C for deployment in industrial environments.
• Regulatory Status RoHS compliant.

Unique Advantages

• High logic capacity: 1,176,000 logic elements enable consolidation of large functions onto a single device, reducing board count and simplifying system design.
• Substantial on-chip memory: Approximately 62.26 Mbits of embedded RAM supports data-heavy processing without relying solely on external memory.
• Extensive I/O resources: 702 I/O provide flexibility for multi-channel interfaces, sensor arrays, or high-speed connectivity needs.
• Industrial-grade operating range: −40°C to 100°C specification supports deployment in environments with wide temperature variation.
• Compact, high-density package: 1760-FCBGA (42.5 × 42.5 mm) surface-mount packaging delivers high pin count in a standardized BGA footprint for stable board-level integration.
• RoHS compliant: Conforms to common lead-free environmental requirements for modern electronic assemblies.

Why Choose XCVU095-2FFVB1760I?

The XCVU095-2FFVB1760I positions itself as a high-capacity, industrial-grade FPGA option for designs that require significant programmable logic, on-chip memory, and extensive I/O. Its combination of 1,176,000 logic elements, approximately 62.26 Mbits of embedded RAM, and 702 I/O axes makes it suitable for consolidating complex systems and enabling scalable implementation of large digital designs.

Engineers and procurement teams looking for a robust, high-density FPGA in a surface-mount 1760-FCBGA package will find this device appropriate for demanding industrial applications that benefit from high integration and predictable operating specifications.

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