XCVU095-2FFVC1517E

The XCVU095-2FFVC1517E is a Virtex® UltraScale™ Field Programmable Gate Array (FPGA) IC manufactured by AMD. It delivers large on-chip resources and a high I/O count in a 1517-BBGA FCBGA package for surface-mount assembly.

With 67,200 CLBs, 1,176,000 logic elements, approximately 62.26 Mbits of embedded memory, and 520 I/O, this device targets designs that require high logic density, substantial on-chip RAM, and extensive external connectivity while operating within an extended-grade temperature range.

Key Features

• Core Logic: 67,200 CLBs and 1,176,000 logic elements provide large programmable fabric capacity for complex logic implementations.
• Memory: Approximately 62.26 Mbits of total RAM bits for on-chip buffering, caching, and data-path storage.
• I/O: 520 available I/O pins to support multiple external interfaces and high-channel-count connectivity.
• Package & Mounting: 1517-BBGA, FCBGA package (supplier device package: 1517-FCBGA 40×40) designed for surface-mount assembly.
• Power Supply Range: Nominal voltage supply range of 922 mV to 979 mV for core power domains.
• Temperature & Grade: Extended grade device rated for operation from 0 °C to 100 °C.
• Manufacturer: Produced by AMD.

Typical Applications

• High-density logic systems: Implement large-scale custom logic using the device's 1,176,000 logic elements and 67,200 CLBs.
• Memory-intensive data paths: Use the approximately 62.26 Mbits of embedded memory for buffering, packet handling, or streaming data tasks.
• I/O-rich platforms: Support multiple external sensors, transceivers, or peripherals with 520 I/O pins for broad connectivity options.

Unique Advantages

• Large programmable fabric: High CLB and logic-element counts enable more functionality to be implemented on a single device, reducing the need for multiple FPGAs.
• Significant on-chip RAM: Approximately 62.26 Mbits of RAM reduces reliance on external memory for many buffering and streaming use cases.
• Extensive I/O capability: 520 I/O pins facilitate integration with many peripherals and external interfaces without additional bridge components.
• Production-ready package: 1517-FCBGA (40×40) surface-mount package supports standard assembly workflows and high-density board designs.
• Extended operating range: Rated for 0 °C to 100 °C and marked as Extended grade to meet broader environmental requirements.

Why Choose XCVU095-2FFVC1517E?

The XCVU095-2FFVC1517E positions itself as a high-capacity Virtex® UltraScale™ FPGA option for designs that demand a large logic fabric, substantial on-chip memory, and a high number of I/O. Its 1517-FCBGA surface-mount package and extended-grade rating make it suitable for production systems requiring dense integration and reliable operation within the specified temperature range.

Engineers and procurement teams selecting this AMD-manufactured device can consolidate complex functionality onto a single FPGA, taking advantage of the device’s logic, memory, and I/O resources to simplify board-level design and reduce component count.

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