XCVU095-2FFVD1517E

The XCVU095-2FFVD1517E is a Virtex® UltraScale™ field programmable gate array (FPGA) from AMD. It provides a large programmable fabric with high logic capacity and on-chip memory, packaged in a 1517-ball FCBGA for surface-mount assembly. This device is intended for designs that require substantial programmable logic resources, dense I/O, and extended-grade operating conditions.

Key Features

• Logic Capacity Contains approximately 1,176,000 logic elements to support complex programmable logic implementations and large-scale designs.
• Embedded Memory Provides approximately 62.26 Mbits of on-chip RAM for data buffering, state storage, and implemented memory structures.
• I/O Density Offers 338 I/O pins to support wide external interfacing and multi-channel connectivity.
• Packaging Supplied in a 1517-BBGA (1517-FCBGA, 40×40) package, optimized for surface-mount PCB assembly and compact system integration.
• Power Operates from a core voltage supply range of 922 mV to 979 mV, allowing designers to plan power delivery and sequencing accurately.
• Operating Range & Grade Rated for operation from 0 °C to 100 °C with an extended device grade designation for broader environmental use.
• Compliance RoHS compliant to meet common environmental and materials requirements.

Typical Applications

• High-density programmable logic — Used where large logic element counts are required to implement custom hardware functions and complex state machines.
• On-chip buffering and data handling — Embedded memory supports data paths, FIFOs, and temporary storage for custom processing pipelines.
• Dense I/O interfacing — The 338 I/O pins facilitate multiple peripheral connections and wide parallel interfaces in compact system designs.

Unique Advantages

• High logic element count: Approximately 1,176,000 logic elements enable implementation of large, integrated digital designs without external ASICs.
• Significant embedded memory: Approximately 62.26 Mbits of on-chip RAM reduce external memory dependence and simplify board-level BOM.
• Ample I/O resources: 338 I/O pins support complex interconnect and multi-channel system architectures.
• Compact FCBGA package: The 1517-FCBGA (40×40) package provides a high-density solution for space-constrained PCBs while supporting surface-mount manufacturing.
• Defined power window: Core supply range of 922 mV to 979 mV allows precise power planning for reliable operation.
• Extended operating grade: 0 °C to 100 °C rating offers flexibility for applications requiring broader ambient temperature support.

Why Choose XCVU095-2FFVD1517E?

The XCVU095-2FFVD1517E positions itself as a high-capacity Virtex® UltraScale™ FPGA suitable for designs that demand abundant logic resources, substantial embedded memory, and dense I/O in a compact FCBGA package. Its extended-grade temperature rating and defined core voltage range make it a practical choice for systems requiring stable, verifiable electrical and environmental parameters.

Designers and procurement teams looking for a programmable platform that consolidates logic, memory, and I/O into a single device will find this FPGA aligns with needs for scalability, integration, and RoHS compliance within their supply chain and design requirements.

Request a quote or contact sales to discuss availability, pricing, and how the XCVU095-2FFVD1517E can meet your project requirements.