XCVU095-2FFVC2104I

The XCVU095-2FFVC2104I is a Virtex® UltraScale™ Field Programmable Gate Array (FPGA) IC from AMD. It provides large programmable logic capacity, substantial embedded memory, and a high I/O count in a 2104‑FBGA (47.5 × 47.5 mm) surface-mount package.

Targeted at designs requiring significant on-chip resources and industrial temperature operation, this device combines approximately 1,176,000 logic elements, approximately 62.26 Mbits of embedded memory, and 416 I/O pins to support complex digital systems.

Key Features

• Programmable Logic  Approximately 1,176,000 logic elements to implement large-scale custom digital functions and parallel datapaths.
• Embedded Memory  Approximately 62.26 Mbits of on-chip RAM for buffering, lookup tables, and intermediate data storage.
• I/O Density  416 configurable I/O pins to support multi‑lane interfaces, wide buses, and diverse peripheral connectivity.
• Package & Mounting  2104‑FCBGA package (47.5 × 47.5 mm) with surface-mount mounting for high I/O density and system integration.
• Power Range  Core supply range specified between 922 mV and 979 mV for precise power budgeting and supply design.
• Operating Temperature  Industrial-grade operation from −40 °C to 100 °C for deployment in demanding ambient conditions.
• Compliance  RoHS compliant.

Typical Applications

• High-density FPGA designs  Implement large custom logic blocks and parallel processing engines using the device’s approximately 1,176,000 logic elements and large embedded memory.
• Data buffering and packet processing  Leverage the approximately 62.26 Mbits of on-chip RAM and 416 I/Os for multi‑lane data capture, queuing, and packet inspection tasks.
• System integration and prototyping  Use the 2104‑FCBGA package and broad I/O complement to consolidate system functions and validate complex digital subsystems.

Unique Advantages

• High on-chip resources: Substantial logic and embedded memory enable integration of multiple functions on a single device, reducing board-level complexity.
• Large I/O count: 416 I/Os simplify interfacing with multiple peripherals, wide buses, and multi‑lane links without external multiplexing.
• Industrial temperature range: Rated from −40 °C to 100 °C for reliable operation across a broad set of environmental conditions.
• Compact, high-density package: 2104‑FCBGA (47.5 × 47.5 mm) offers a balance of footprint and I/O density for space-constrained systems.
• Defined core supply window: 922 mV to 979 mV specification aids precise power supply design and validation.
• RoHS compliant: Facilitates regulatory compliance for assemblies requiring restricted-substance adherence.

Why Choose XCVU095-2FFVC2104I?

The XCVU095-2FFVC2104I is positioned for designs that demand very large programmable logic capacity, substantial embedded RAM, and high I/O connectivity within an industrial temperature envelope. Its combination of approximately 1,176,000 logic elements, approximately 62.26 Mbits of on-chip memory, and 416 I/Os in a 2104‑FCBGA package supports consolidation of complex digital subsystems and simplifies board-level integration.

Engineers specifying this FPGA can expect a device suited to scalable, resource‑intensive designs where on-chip logic, memory, and I/O density drive system architecture decisions and long-term product robustness.

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