XCVU095-H1FFVC1517E

The XCVU095-H1FFVC1517E is a Virtex UltraScale field programmable gate array (FPGA) IC from AMD designed for designs that require very large logic capacity and substantial on-chip memory. With a high count of logic resources, extensive embedded RAM and a 520-pin I/O footprint in a 1517-FCBGA package, it targets applications that need dense logic integration, significant memory bandwidth and a high I/O count.

Key Features

• Logic Fabric  67,200 CLBs and 1,176,000 logic elements provide a large programmable fabric for implementing complex digital designs and extensive custom logic.
• Embedded Memory  Approximately 62.3 Mbits of on-chip RAM (62,259,200 bits) for buffering, state storage and memory-intensive functions within the FPGA.
• I/O Capacity  520 user I/O pins to support high-pin-count interfaces and multiple parallel buses or channelized connectivity.
• Power Supply Range  Core voltage supply range from 922 mV to 1.03 V, enabling compatibility with targeted system power rails.
• Package and Mounting  1517-BBGA (1517-FCBGA, 40×40) surface-mount package suitable for dense PCB implementations.
• Operating Range and Grade  Extended grade device with an operating temperature range of 0 °C to 100 °C and RoHS compliance for regulatory alignment.

Typical Applications

• Complex digital systems and prototyping  Ideal for designs that require large numbers of logic elements and extensive programmable fabric for prototyping or deployment of complex algorithms.
• Memory‑intensive processing  Well suited to embedded designs that make use of substantial on-chip RAM for buffering, packet queues or internal data storage.
• High‑pin‑count I/O systems  Useful where many parallel interfaces or channelized connectivity are needed, leveraging the 520 available I/O pins.

Unique Advantages

• High logic capacity: The combination of 67,200 CLBs and 1,176,000 logic elements enables implementation of large-scale digital functions without external logic expansion.
• Significant on-chip memory: Approximately 62.3 Mbits of embedded RAM reduces dependence on external memory for many buffering and state-storage needs.
• Robust I/O resources: 520 I/O pins allow flexible interfacing with multiple peripherals, buses and channelized data streams.
• Compact package: 1517-FCBGA (40×40) surface-mount package provides a high-density physical footprint for space-constrained PCB designs.
• Extended operating range: Rated for 0 °C to 100 °C operation and RoHS compliant, supporting deployment in a variety of standard commercial and extended-temperature environments.

Why Choose XCVU095-H1FFVC1517E?

The XCVU095-H1FFVC1517E delivers a high-capacity Virtex UltraScale FPGA platform combining large logic resources, substantial embedded RAM and a 520-pin I/O complement in a compact 1517-FCBGA package. It is positioned for designs that require dense integration of programmable logic and on-chip memory while remaining within an extended temperature operating window.

This device is suited for customers building scalable, memory‑heavy or high‑I/O digital systems who value a single-chip solution with a clear specification set for logic, memory, power and package. Its RoHS compliance and surface-mount FCBGA package support modern manufacturing and assembly workflows.

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