XCVU095-H1FFVA2104E

The XCVU095-H1FFVA2104E is a Virtex® UltraScale™ Field Programmable Gate Array (FPGA) IC from AMD. It integrates a very high logic capacity with substantial on-chip RAM and a large number of I/O pins to support complex, high-density digital designs.

With 1,176,000 logic elements, approximately 62.26 Mbits of on-chip RAM, and 832 I/O, this device is intended for applications that require significant programmable logic, memory resources, and extensive connectivity while operating within a 0 °C to 100 °C temperature range.

Key Features

• Logic Capacity — 1,176,000 logic elements, supported by 67,200 configurable logic blocks (CLBs) for large-scale custom logic implementation.
• On-Chip Memory — Approximately 62.26 Mbits of total RAM bits for buffering, state storage, and local data handling.
• I/O — 832 general-purpose I/O pins to support extensive external interfacing and high channel counts.
• Package — 2104-BBGA (2104-FCBGA) package, supplier device package 2104-FCBGA with 47.5 × 47.5 mm dimensions, suitable for high-pin-count board designs.
• Power — Core voltage supply range from 922 mV to 1.03 V, enabling defined power-domain design and supply planning.
• Operating Range — Rated for operation from 0 °C to 100 °C and supplied in an Extended grade.
• Mounting — Surface mount package for standard PCB assembly processes.
• Compliance — RoHS compliant to support lead-free assembly and regulatory preferences.

Typical Applications

• Custom compute acceleration — Use the high logic element count and on-chip RAM to implement application-specific accelerators and data-paths.
• Large-scale interfacing and aggregation — Leverage 832 I/O pins for multi-channel data acquisition, protocol bridging, or complex peripheral connectivity.
• Memory-intensive designs — Approximately 62 Mbits of on-chip RAM supports buffering, caching, and state storage within the FPGA fabric.

Unique Advantages

• High logic density: 1,176,000 logic elements enable implementation of large, complex digital functions on a single device.
• Significant on-chip RAM: Approximately 62.26 Mbits of RAM reduces external memory dependencies for many buffering and storage needs.
• Extensive I/O capacity: 832 I/O pins simplify board-level design by supporting numerous external interfaces without multiplexing compromises.
• Robust package option: The 2104-FCBGA (47.5 × 47.5 mm) package provides the pin count and thermal footprint required for high-pin-count implementations.
• Defined power requirements: A core voltage range of 922 mV to 1.03 V allows precise power supply planning for multi-voltage system designs.
• Extended temperature grade: Rated for 0 °C to 100 °C operation, suitable for a range of standard environmental conditions.

Why Choose XCVU095-H1FFVA2104E?

The XCVU095-H1FFVA2104E positions itself as a high-capacity Virtex UltraScale FPGA that combines substantial programmable logic, significant on-chip memory, and broad I/O resources in a single 2104-FCBGA package. Its electrical and thermal characteristics make it appropriate for designs that demand large-scale logic integration and extensive external connectivity.

This device is suited to engineers and procurement teams developing complex FPGA-based systems who require predictable power requirements, a clearly defined operating temperature range, and RoHS-compliant packaging. Its specification set supports scalable designs where consolidating functions into a single, high-density FPGA provides long-term design flexibility and reduced board-level complexity.

Request a quote or submit an application for pricing and availability for the XCVU095-H1FFVA2104E to receive a formal proposal and lead-time information.