XCVU11P-1FLGB2104I

The XCVU11P-1FLGB2104I is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD, delivered in a 2104-FCBGA package. It provides high logic density, substantial on-chip memory, and a large I/O count for demanding embedded and industrial designs.

Designed for applications that require extensive programmable logic, significant embedded RAM, and robust I/O connectivity, this device combines core performance with industrial temperature capability and a compact FCBGA package footprint.

Key Features

• Core Logic — 2,835,000 logic elements for implementing large-scale programmable logic and complex hardware acceleration functions.
• Embedded Memory — Approximately 396 Mbits of on-chip RAM to support buffering, frame storage, and large state machines without relying solely on external memory.
• I/O Density — 572 I/O pins to accommodate multiple parallel interfaces, high-pin-count peripherals, and flexible board-level connectivity.
• Package & Mounting — 2104-FCBGA (47.5 × 47.5 mm) package (listed as 2104-BBGA, FCBGA) and surface-mount mounting type for high-density board integration.
• Power Supply — Core voltage supply range of 0.825 V to 0.876 V to match system power design requirements.
• Temperature Range — Industrial-grade operation from −40 °C to 100 °C for deployment in a wide range of environments.
• Regulatory — RoHS compliant.

Typical Applications

• High-density digital systems — Use the large logic element count to implement complex signal processing, protocol bridging, or custom compute blocks on a single device.
• On-chip buffering and state storage — Leverage approximately 396 Mbits of embedded memory for data buffering, packet buffering, or local frame storage without immediate dependence on external RAM.
• Multi-I/O interface hubs — Support numerous parallel and serial connections using the 572 available I/O pins for board-level interface consolidation.

Unique Advantages

• High logic density: 2,835,000 logic elements allow large designs to be implemented on a single FPGA, reducing system complexity and the number of discrete devices required.
• Substantial embedded memory: Approximately 396 Mbits of on-chip RAM enable larger on-device data structures and buffering, improving latency and reducing external memory traffic.
• Extensive I/O capacity: 572 I/O pins provide flexibility to connect multiple peripherals and interfaces without compromise.
• Industrial temperature rating: Rated for −40 °C to 100 °C operation to meet the needs of industrial applications with wider thermal ranges.
• Compact FCBGA package: 2104-FCBGA (47.5 × 47.5 mm) supports high-density PCB layouts while maintaining robust soldered mounting.
• Controlled core voltage: 0.825–0.876 V supply range supports predictable power delivery and integration into power-managed systems.

Why Choose XCVU11P-1FLGB2104I?

The XCVU11P-1FLGB2104I positions itself for designs that require a combination of very large programmable logic capacity, significant on-chip memory, and broad I/O connectivity within an industrial temperature envelope. Its 2104-FCBGA package and defined core voltage range make it suitable for compact, high-density boards where reliable operation across a wide temperature range is required.

For engineering teams building complex, scalable hardware platforms, this Virtex® UltraScale+™ device offers a balance of integration and predictable electrical and thermal characteristics while remaining RoHS compliant and backed by a leading FPGA manufacturer.

Request a quote or submit an inquiry for pricing and availability for the XCVU11P-1FLGB2104I to begin procurement and design planning.