XCVU11P-2FLGB2104E

The XCVU11P-2FLGB2104E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC designed for high logic density and large on-chip memory capacity. With millions of logic elements, hundreds of I/Os and substantial embedded RAM, it targets designs that require dense programmable logic, significant memory resources, and broad I/O connectivity.

Key Features

• Logic Capacity — Provides approximately 2,835,000 logic elements and 162,000 logic blocks to support complex, high-density digital designs.
• Embedded Memory — Approximately 396 Mbits of on-chip RAM available for buffering, packet storage, and fast local data processing.
• I/O & Integration — 572 user I/Os for wide interface options and high channel counts in system designs.
• Power Supply — Core supply range of 825 mV to 876 mV, enabling defined power planning for the device core.
• Package & Mounting — Supplied in a 2104-FCBGA package (47.5 × 47.5 mm) / 2104-BBGA, suitable for surface-mount PCB assembly.
• Operating Range & Grade — Extended grade device rated for 0 °C to 100 °C operating temperature.
• Compliance — RoHS compliant.

Typical Applications

• High-density digital processing — Leverage the approximately 2.8M logic elements and 396 Mbits of embedded memory for complex signal processing and compute-intensive logic.
• High-channel I/O systems — Use the 572 I/Os to interface with large arrays of sensors, transceivers, or parallel peripherals.
• System prototyping and integration — The combination of logic capacity and on-chip RAM supports platform-level prototyping and integration where configurable logic and memory are required.

Unique Advantages

• High logic density: Large logic element count enables consolidation of multiple functions into a single device, reducing board-level complexity.
• Substantial embedded memory: Approximately 396 Mbits of on-chip RAM supports data buffering and local storage without external memory in many use cases.
• Extensive I/O capability: 572 I/Os allow flexible interface options and high channel counts for system-level connectivity.
• Compact FCBGA package: 2104-FCBGA (47.5 × 47.5 mm) provides a high-pin-count, surface-mount solution for densely packed PCBs.
• Defined power envelope: Core voltage range (0.825–0.876 V) simplifies power-supply design and validation for the device core.
• Extended temperature grade: Rated for 0 °C to 100 °C operation to match many commercial and extended-environment applications.

Why Choose XCVU11P-2FLGB2104E?

The XCVU11P-2FLGB2104E positions itself as a high-capacity, highly integrated FPGA solution for projects that require significant logic resources, abundant on-chip memory, and extensive I/O. Its combination of approximately 2.8 million logic elements, roughly 396 Mbits of embedded RAM, and 572 I/Os delivers a platform suitable for complex digital systems and dense integration on surface-mount PCBs.

Designed for engineers and procurement teams seeking scalability and integration, this Virtex® UltraScale+™ device offers a balance of performance-oriented resources, a defined core voltage range for power planning, and extended-grade temperature operation to support longer life-cycle deployments.

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