XCVU11P-3FSGD2104E

The XCVU11P-3FSGD2104E is a Virtex® UltraScale+™ FPGA from AMD, supplied in a 2104-FCBGA surface-mount package. It delivers a combination of high logic capacity, extensive embedded memory, and a large I/O count for designs that require substantial on-chip resources.

With a measured supply voltage range and extended-grade temperature rating, this device is intended for applications that need high-density programmable logic and significant on-chip memory while conforming to RoHS requirements.

Key Features

• Logic Capacity — 162,000 configurable logic blocks (CLBs) and 2,835,000 logic elements provide extensive programmable fabric for complex designs.
• Embedded Memory — Approximately 396 Mbits of on-chip RAM to support large buffers, FIFOs, and memory-intensive logic functions.
• I/O — 572 general-purpose I/O pins to support wide interfacing and high-density external connectivity.
• Package & Mounting — Supplied in a 2104-BBGA / 2104-FCBGA package (supplier device package: 2104-FCBGA, 47.5×47.5 mm), designed for surface-mount assembly.
• Power — Core voltage supply specified from 873 mV to 927 mV for system power planning.
• Temperature & Grade — Extended grade with an operating temperature range of 0°C to 100°C for deployments requiring broader-than-commercial thermal tolerance.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High-density FPGA designs — Use the large logic and CLB count to implement complex programmable architectures and custom datapaths.
• Memory-intensive processing — Approximately 396 Mbits of embedded RAM support large on-chip buffers and state storage for streaming or packet-processing tasks.
• High-pin-count interfaces — 572 I/O enable devices to connect to multiple peripherals, wide buses, or parallel interfaces.

Unique Advantages

• High logic integration: Millions of logic elements and a six-figure CLB count allow consolidation of multiple functions into a single device, reducing board-level complexity.
• Substantial on-chip memory: Approximately 396 Mbits of embedded RAM reduces dependence on external memory for many buffering and caching needs.
• Extensive I/O capacity: 572 I/O pins provide the signal density required for complex system interfaces and parallel data paths.
• Compact FCBGA package: The 2104-FCBGA (47.5×47.5 mm) surface-mount package balances high pin count with a compact footprint for dense board layouts.
• Predictable power window: Defined core supply range (873 mV–927 mV) supports precise power delivery design and management.
• Extended temperature rating: 0°C to 100°C operation supports deployments that require a wider ambient range than standard commercial grade.

Why Choose XCVU11P-3FSGD2104E?

The XCVU11P-3FSGD2104E positions itself as a high-capacity programmable logic device within the Virtex UltraScale+ family, combining extensive logic resources, large embedded memory, and a high I/O count in a single FCBGA package. These attributes make it well suited to designs that need to integrate multiple functions on-chip while maintaining signal density and memory bandwidth.

For teams designing complex FPGA-based systems that require scalable logic, significant on-chip RAM, and a defined power and thermal profile, this part offers a resource-rich platform that supports consolidation and system-level simplification.

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