XCVU11P-L2FLGB2104E

The XCVU11P-L2FLGB2104E is a Virtex® UltraScale+™ field programmable gate array (FPGA) from AMD, offered in a 2104-ball FCBGA package (47.5 × 47.5 mm). Built on the UltraScale+ family architecture, this device targets high-bandwidth, compute-intensive systems where high logic capacity, large embedded memory, and extensive I/O are required.

Typical market applications for the UltraScale+ family include high-throughput data center, wired communications, and waveform processing systems. The family-level architecture described in the product literature emphasizes improved system-level performance-per-watt, increased integration, and high I/O bandwidth.

Key Features

• Core Logic  Approximately 2,835,000 logic elements providing large programmable fabric for complex custom logic and compute pipelines.
• Embedded Memory  Approximately 396 Mbits of embedded memory for on-chip buffering, packet processing, and local storage.
• I/O Density  572 I/O pins to support dense external interfaces and multi-channel connectivity.
• Package & Mounting  2104-BBGA (2104-FCBGA, 47.5 × 47.5 mm) surface-mount package suitable for high-pin-count board designs.
• Operating Range & Grade  Extended-grade device rated for operation from 0°C to 100°C.
• Supply Voltage  Supported core voltage range of 698 mV to 876 mV for power management and performance scaling.
• UltraScale+ Architecture (family)  Family-level features include improved performance-per-watt, ASIC-class clocking, enhanced DSP capability, and options such as integrated high-bandwidth memory (HBM) and high-speed transceivers as described in the UltraScale+ product literature.
• Design Flow  UltraScale+ devices are described as co-optimized with the Vivado® Design Suite and leverage the UltraFAST™ design methodology to accelerate development (family-level information).
• RoHS Compliant  Device is RoHS compliant.

Typical Applications

• Data Center & Networking  High logic capacity and dense I/O enable custom packet processing, routing, and aggregation tasks in high-throughput network equipment.
• Wired Communications  Large embedded memory and extensive I/O facilitate multi-protocol framing, SERDES interfacing, and real-time data handling.
• Waveform Processing  Programmable fabric and embedded memory allow implementation of high-performance signal processing chains and buffering for waveform analysis.
• High-Bandwidth Systems  Suitable for systems that require significant logic, memory, and I/O resources to implement aggregation, acceleration, or custom compute functions.

Unique Advantages

• Substantial Logic Capacity:  Approximately 2.8 million logic elements enable large-scale custom designs and complex acceleration engines.
• Large On-Chip Memory:  Approximately 396 Mbits of embedded memory supports deep buffering and reduces dependence on external memory for many tasks.
• High I/O Count:  572 I/O pins provide flexibility for multi-channel interfaces and dense system integration.
• Family-Level Performance & Efficiency:  The UltraScale+ family is described as providing improved system-level performance-per-watt and integration options—beneficial for power-constrained, high-throughput designs.
• Package for High-Pin Designs:  2104-ball FCBGA package (47.5 × 47.5 mm) supports large BGA routing and thermal management strategies on high-density boards.
• Extended Grade Operation:  Rated for 0°C to 100°C operation to match many commercial and extended-environment system requirements.

Why Choose XCVU11P-L2FLGB2104E?

The XCVU11P-L2FLGB2104E combines the Virtex UltraScale+ architecture’s family-level emphasis on performance-per-watt and integration with device-level capacity: millions of logic elements, hundreds of megabits of embedded memory, and hundreds of I/O pins in a high-ball-count FCBGA package. It is positioned for designers building bandwidth-focused, compute-heavy systems that require significant on-chip resources and flexible I/O.

This device is well suited to engineering teams that need scalable FPGA fabric, substantial on-chip memory, and a package designed for large designs—backed by the UltraScale+ family design methodology and toolchain references included in the product literature.

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