XCVU11P-2FSGD2104I

The XCVU11P-2FSGD2104I is a Virtex® UltraScale+™ field programmable gate array (FPGA) supplied in a 2104-FCBGA package. It provides a combination of high logic capacity, substantial on‑chip memory, and a large I/O count for complex, industrial-grade designs.

Targeted at designs that require dense programmable logic and embedded memory, this device supports robust operation across an industrial temperature range and a defined low-voltage core supply window.

Key Features

• Logic Capacity  Includes 2,835,000 logic elements and 162,000 CLBs for high-density digital implementation and complex logic architectures.
• Embedded Memory  Approximately 396 Mbits of on-chip RAM to support large buffering, caching, and state-machine storage requirements.
• I/O  Provides 572 I/O pins to accommodate extensive peripheral interfaces, multi-channel data paths, and high-pin-count system integration.
• Package  Supplied in a 2104-FCBGA package (47.5 × 47.5 mm) for high-pin-count board-level integration and thermal handling.
• Power  Core voltage supply specified between 825 mV and 876 mV, allowing designers to plan power delivery and regulator selection precisely.
• Temperature and Grade  Industrial grade operation with an ambient operating range from −40 °C to 100 °C for deployment in demanding environments.
• Mounting and Compliance  Surface-mount device construction and RoHS compliance for modern assembly processes and environmental requirements.

Typical Applications

• High-density compute and signal processing  Leverage millions of logic elements and substantial embedded RAM for hardware acceleration and real-time processing tasks.
• Multi-channel I/O systems  Use the 572 I/O pins to implement complex interfacing, parallel data acquisition, and high-channel-count communication fabrics.
• Industrial control and automation  Industrial temperature rating and robust packaging support deployment in factory and industrial environments requiring continuous operation.

Unique Advantages

• Highly integrated resources: Combines millions of logic elements with approximately 396 Mbits of embedded RAM to reduce external component needs and simplify board designs.
• Extensive I/O availability: High I/O count enables direct interfacing to numerous peripherals and parallel data paths, reducing need for additional interface chips.
• Industrial temperature capability: Qualified for −40 °C to 100 °C operation, supporting deployment in temperature-challenging environments without additional thermal derating assumptions.
• Predictable power rails: Defined core voltage range (825 mV–876 mV) allows precise power-supply selection and margin planning for reliable operation.
• RoHS compliance: Meets environmental and manufacturing requirements for lead-free assembly processes.

Why Choose XCVU11P-2FSGD2104I?

The XCVU11P-2FSGD2104I positions itself as a high-capacity, industrial-grade FPGA that combines extensive programmable logic, significant on-chip memory, and a broad I/O complement in a single 2104-FCBGA package. These attributes make it suitable for designs that require dense logic integration, large embedded memory, and reliable operation across a wide temperature range.

Engineers and procurement teams seeking a scalable platform for complex signal processing, multi-channel interfacing, or industrial control systems will find its resource balance and defined electrical and thermal parameters helpful for long-term design planning and system robustness.

Request a quote or submit your specifications to receive pricing and lead-time information for the XCVU11P-2FSGD2104I.