XCVU11P-1FLGC2104I

The XCVU11P-1FLGC2104I is a Virtex® UltraScale+™ FPGA IC delivering large-scale programmable logic and embedded memory in a 2104-FCBGA package. Its architecture provides substantial logic capacity, embedded RAM, and a high I/O count for complex, system-level designs.

Designed for industrial-grade applications, this device targets designs that require significant on-chip resources and flexible I/O while operating across a broad temperature and core voltage range.

Key Features

• Logic Capacity  Approximately 2,835,000 logic elements, supported by 162,000 CLBs for large-scale programmable logic implementations.
• Embedded Memory  Approximately 396 Mbits of embedded memory to support data buffering, lookup tables, and local storage without external RAM.
• I/O Resources  416 user I/O pins to interface with high-density peripherals, sensors, and external subsystems.
• Power Supply  Core voltage supply range of 825 mV to 876 mV, enabling integration into systems with tightly controlled power rails.
• Package  2104-FCBGA (47.5 × 47.5 mm) package case offering a compact form factor for high-density board layouts.
• Mounting & Grade  Surface-mount device specified for industrial grade operation.
• Operating Temperature  Rated for −40°C to 100°C to meet a wide range of environmental conditions.
• RoHS Compliant  Meets RoHS requirements for material compliance.

Typical Applications

• Compute Acceleration  Large logic capacity and substantial embedded memory enable hardware acceleration tasks that require intensive parallelism and local data storage.
• High-Density I/O Systems  With 416 I/Os, the device supports dense peripheral interfacing and multi-channel data acquisition or control tasks.
• Industrial Control & Automation  Industrial grade temperature range and robust on-chip resources make it suitable for complex control logic and signal processing in industrial environments.
• Test & Measurement  Embedded memory and extensive logic resources support custom measurement, capture, and analysis functions within a single FPGA.

Unique Advantages

• High logic and CLB density: Large population of logic elements and CLBs reduces the need for multiple devices, simplifying system design.
• Substantial on-chip memory: Approximately 396 Mbits of embedded RAM minimizes external memory dependencies and improves data locality.
• Extensive I/O capability: 416 I/O pins enable broad connectivity options for sensors, interfaces, and peripheral subsystems.
• Industrial temperature rating: Operation from −40°C to 100°C supports deployment in harsh and variable environments.
• Compact FCBGA package: The 2104-FCBGA (47.5 × 47.5 mm) package provides a high-density solution for space-constrained PCBs.
• Regulatory compliance: RoHS compliance supports environmentally driven manufacturing requirements.

Why Choose XCVU11P-1FLGC2104I?

The XCVU11P-1FLGC2104I combines large logic capacity, significant embedded memory, and a high I/O count in an industrial-grade FCBGA package, offering a balanced platform for complex, resource-intensive FPGA designs. Its specified core voltage range and wide operating temperature justify its use in demanding system-level applications where on-chip resources and reliability matter.

This device is well suited for engineers and teams building solutions that require scalable programmable logic, ample local memory, and robust I/O integration—providing a single-device approach to reduce system complexity and board-level BOM.

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