XCVU11P-1FLGC2104E

IC FPGA 416 I/O 2104FCBGA
Part Description

Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC 416 396150400 2835000 2104-BBGA, FCBGA

Quantity 1,333 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package2104-FCBGA (47.5x47.5)GradeExtendedOperating Temperature0°C – 100°C
Package / Case2104-BBGA, FCBGANumber of I/O416Voltage825 mV - 876 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs162000Number of Logic Elements/Cells2835000
Number of GatesN/AECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits396150400

Overview of XCVU11P-1FLGC2104E – Virtex® UltraScale+™ Field Programmable Gate Array (FPGA), 2104-FCBGA

The XCVU11P-1FLGC2104E is a Virtex® UltraScale+™ FPGA designed for high-bandwidth, system-level integration. Based on the UltraScale+ family architecture, it targets data-intensive applications such as data center networking, wired communications, and waveform processing where large logic capacity and high I/O density are required.

This device combines approximately 2,835,000 logic elements with roughly 396 Mbits of embedded memory, 416 I/O pins and a 2104-FCBGA package (47.5 × 47.5 mm), offering a platform for designs that demand high logic density, large on-chip memory and robust I/O connectivity.

Key Features

  • Logic Capacity  Approximately 2,835,000 logic elements to implement complex, high-density logic and control functions.
  • Embedded Memory  Approximately 396 Mbits of on-chip RAM for buffering, LUT-based memory and fast local storage.
  • I/O Density  416 I/O pins to support wide parallel interfaces and high pin-count connectivity.
  • Power Supply  Supported core voltage range of 825 mV to 876 mV, enabling targeted power and performance scaling.
  • Package & Mounting  2104-FCBGA package (47.5 × 47.5 mm) in a surface-mount FCBGA form factor for high-pin-count system integration.
  • Operating Range  Extended-grade device specified for 0 °C to 100 °C ambient operating temperature.
  • Standards & Compliance  RoHS compliant for regulatory and manufacturing compatibility.
  • UltraScale+ Family Capabilities  Leverages UltraScale+ architecture benefits including industry-leading performance-per-watt, co-optimization with the Vivado Design Suite, and options in the family such as high-bandwidth memory (HBM) and high-speed serial transceivers for multi-terabit systems (family-level features).

Typical Applications

  • Data Center Networking  Implement packet processing, traffic management and custom switching logic using high logic capacity and dense I/O.
  • Wired Communications  Support high-throughput line cards and protocol offload with extensive on-chip memory and high I/O counts.
  • Waveform Processing  Handle real-time signal processing tasks where large logic resources and embedded RAM are needed for buffering and computation.
  • High-Performance Computing Accelerators  Deploy custom compute kernels and dataflow architectures using substantial logic and memory resources (family-level DSP and memory capabilities described in the UltraScale+ product brief).

Unique Advantages

  • Large Logic Resource Pool: Approximately 2.8 million logic elements let you consolidate complex functions on a single device, reducing board-level component count.
  • Significant On-Chip Memory: Approximately 396 Mbits of embedded memory enables large buffering and low-latency data paths without immediate reliance on external DRAM.
  • High I/O Pin Count: 416 I/O pins provide the interface density required for wide parallel buses and multi-lane external interfaces.
  • Extended-Grade Thermal Range: Specified for 0 °C to 100 °C to support a variety of controlled-environment deployments.
  • System-Level Architecture: Built on the UltraScale+ architecture and co-optimized with the Vivado Design Suite, enabling streamlined implementation and design portability within the UltraScale+ family.
  • RoHS Compliance: RoHS status simplifies compliance for lead-free assembly and environmental requirements.

Why Choose XCVU11P-1FLGC2104E?

The XCVU11P-1FLGC2104E positions itself as a high-density, system-oriented FPGA option within the Virtex UltraScale+ family. Its large logic element count, substantial embedded memory and high I/O complement designs that require extensive on-chip resources and robust connectivity while maintaining compatibility with the UltraScale+ design ecosystem.

This device is suited for engineering teams building high-throughput, data-centric systems—where consolidation, predictable thermal operation (0 °C to 100 °C), and package-level integration (2104-FCBGA) are key considerations. The family-level features described in the UltraScale+ product brief provide a pathway to scale designs that may leverage advanced memory and transceiver options within the same architecture.

Request a quote or submit a procurement inquiry to receive pricing and availability for the XCVU11P-1FLGC2104E and to discuss how this device can meet your project requirements.

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