XCVU11P-2FLGF1924I

The XCVU11P-2FLGF1924I is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 1924‑ball FCBGA (45×45) package. It delivers very large on-chip resources—millions of logic elements, hundreds of megabits of embedded memory and a high I/O count—within an industrial-grade, surface-mount form factor.

This device is appropriate for designs that require substantial logic capacity, significant embedded memory, and broad I/O connectivity, while maintaining operation across an extended temperature range and a defined low-voltage supply window.

Key Features

• Large programmable logic capacity Approximately 2,835,000 logic elements, enabling complex digital designs and large-scale integration on a single device.
• Substantial on-chip memory Approximately 396 Mbits of embedded memory to support buffering, on-chip datasets and state storage without external memory for many functions.
• Extensive I/O 624 I/O pins to support wide parallel interfaces, multiple high-density connections and flexible board-level routing.
• Industrial-grade operating range Rated for operation from -40 °C to 100 °C, suitable for applications requiring extended temperature capability.
• Low-voltage supply Specified voltage supply range of 825 mV to 876 mV to match system power-rail constraints and vendor core-voltage requirements.
• Package and mounting 1924‑BBGA (1924‑FCBGA, 45×45) surface-mount package for compact, high-density PCB implementations.
• RoHS compliant Conforms to RoHS requirements for reduced hazardous substances in manufacturing.

Unique Advantages

• High-density integration: Millions of logic elements and large embedded memory reduce the need for multiple discrete devices and lower system BOM complexity.
• Wide connectivity: 624 I/Os provide flexibility for complex multi-channel interfaces and dense board-level interconnects.
• Industrial readiness: Specified -40 °C to 100 °C operation supports deployment in environments with extended temperature demands.
• Compact packaging: 1924‑FCBGA (45×45) enables a high-resource FPGA footprint in a space-efficient, surface-mount package.
• Predictable power domain: A defined 825–876 mV supply range allows designers to match system power architectures and plan thermal/power budgets accurately.
• Compliance with environmental standards: RoHS compliance supports regulatory and sustainability requirements for electronic assemblies.

Why Choose XCVU11P-2FLGF1924I?

The XCVU11P-2FLGF1924I positions itself as a high-capacity, industrial-grade FPGA that consolidates substantial logic resources, large embedded memory and a high I/O count into a single 1924‑ball FCBGA package. These measurable hardware attributes make it suitable for designs that require on-chip scale and connectivity without sacrificing temperature tolerance or package density.

For teams targeting systems that demand large programmable logic arrays, significant on-chip RAM and broad interface options, this device offers a clear hardware profile to plan around—supporting scalable designs with known electrical and thermal parameters.

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