XCVU11P-L2FLGF1924E
| Part Description |
Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC 624 396150400 2835000 1924-BBGA, FCBGA |
|---|---|
| Quantity | 485 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1924-FCBGA (45x45) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1924-BBGA, FCBGA | Number of I/O | 624 | Voltage | 698 mV - 876 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 162000 | Number of Logic Elements/Cells | 2835000 | ||
| Number of Gates | N/A | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 396150400 |
Overview of XCVU11P-L2FLGF1924E – Virtex® UltraScale+™ FPGA, 1924-FCBGA
The XCVU11P-L2FLGF1924E is a Virtex® UltraScale+™ field programmable gate array (FPGA) in a 1924-FCBGA (45×45) package. It implements the UltraScale+ architecture and targets high-bandwidth, high-performance systems including data center, wired communications, and waveform processing applications.
Built for high logic capacity and dense I/O, this extended-grade, surface-mount FPGA delivers a combination of large embedded memory, significant logic resources, and series-level performance-per-watt benefits as described for the Virtex UltraScale+ family.
Key Features
- Core Architecture UltraScale+ architecture with series-level optimizations for performance-per-watt and system bandwidth.
- Logic Capacity Approximately 2,835,000 logic elements to support large, complex digital designs.
- Embedded Memory Approximately 396 Mbits of embedded memory for on-chip buffering and storage.
- I/O Density 624 I/O pins to support high-density system interfaces and board-level connectivity.
- Package & Mounting 1924-FCBGA (45×45) package, surface-mount mounting type for dense system integration.
- Power and Voltage Operates with a supply range of 698 mV to 876 mV for core power domains as specified.
- Operating Temperature & Grade Extended grade with an operating temperature range of 0 °C to 100 °C.
- Series-Level Performance Virtex UltraScale+ family delivers up to 3× system-level performance-per-watt versus prior 7 series devices and includes series options such as integrated HBM and high-speed PAM4 transceivers.
- Design Ecosystem Series documentation indicates co-optimization with the Vivado® Design Suite and UltraFAST™ design methodology to accelerate design integration.
- RoHS Compliance Device is RoHS compliant.
Typical Applications
- Data Center Networking Used for high-throughput packet processing and aggregation in 1+ Tb/s data center systems where large logic and memory resources are required.
- Wired Communications Employed in wired infrastructure and transport systems that need dense I/O and high-bandwidth serial interfaces.
- Waveform Processing Suited to waveform generation and real-time signal processing tasks that benefit from large logic capacity and embedded memory.
- Machine Learning Inference Applicable to energy-efficient inference workloads as indicated by series-level optimizations for machine learning performance-per-watt.
Unique Advantages
- High Logic Density: The device’s approximately 2.8M logic elements enable consolidation of large functions into a single FPGA, reducing system complexity.
- Significant On‑Chip Memory: Roughly 396 Mbits of embedded RAM supports deep buffering and on-chip data processing without immediate dependence on external memory.
- Dense I/O Footprint: 624 I/Os allow direct interfacing to numerous high-speed peripherals and board-level signals.
- Extended Temperature Grade: Rated for 0 °C to 100 °C operation, suitable for systems requiring an extended-grade device.
- Series-Level Integration Options: The UltraScale+ family includes options such as integrated HBM and high-speed transceivers, enabling designs that demand very high memory bandwidth and serial data rates.
- Design Flow Support: Co-optimization with the Vivado® Design Suite and UltraFAST™ methodology helps streamline development and time to market.
Why Choose XCVU11P-L2FLGF1924E?
The XCVU11P-L2FLGF1924E positions itself for designs that require large logic capacity, substantial embedded memory, and a high I/O count in a compact 1924-FCBGA package. As part of the Virtex UltraScale+ family, it benefits from architecture and toolchain features aimed at improving system-level performance-per-watt and enabling high-bandwidth applications.
This device is well suited for engineers building scalable, high-throughput systems—especially in data center, wired communications, and waveform processing domains—where the combination of logic resources, embedded memory, and dense I/O simplifies system architecture and reduces component count.
Request a quote or contact sales to discuss pricing, availability, and integration support for the XCVU11P-L2FLGF1924E.

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