XCVU11P-L2FLGF1924E

IC FPGA 624 I/O 1924FCBGA
Part Description

Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC 624 396150400 2835000 1924-BBGA, FCBGA

Quantity 485 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package1924-FCBGA (45x45)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1924-BBGA, FCBGANumber of I/O624Voltage698 mV - 876 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs162000Number of Logic Elements/Cells2835000
Number of GatesN/AECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits396150400

Overview of XCVU11P-L2FLGF1924E – Virtex® UltraScale+™ FPGA, 1924-FCBGA

The XCVU11P-L2FLGF1924E is a Virtex® UltraScale+™ field programmable gate array (FPGA) in a 1924-FCBGA (45×45) package. It implements the UltraScale+ architecture and targets high-bandwidth, high-performance systems including data center, wired communications, and waveform processing applications.

Built for high logic capacity and dense I/O, this extended-grade, surface-mount FPGA delivers a combination of large embedded memory, significant logic resources, and series-level performance-per-watt benefits as described for the Virtex UltraScale+ family.

Key Features

  • Core Architecture  UltraScale+ architecture with series-level optimizations for performance-per-watt and system bandwidth.
  • Logic Capacity  Approximately 2,835,000 logic elements to support large, complex digital designs.
  • Embedded Memory  Approximately 396 Mbits of embedded memory for on-chip buffering and storage.
  • I/O Density  624 I/O pins to support high-density system interfaces and board-level connectivity.
  • Package & Mounting  1924-FCBGA (45×45) package, surface-mount mounting type for dense system integration.
  • Power and Voltage  Operates with a supply range of 698 mV to 876 mV for core power domains as specified.
  • Operating Temperature & Grade  Extended grade with an operating temperature range of 0 °C to 100 °C.
  • Series-Level Performance  Virtex UltraScale+ family delivers up to 3× system-level performance-per-watt versus prior 7 series devices and includes series options such as integrated HBM and high-speed PAM4 transceivers.
  • Design Ecosystem  Series documentation indicates co-optimization with the Vivado® Design Suite and UltraFAST™ design methodology to accelerate design integration.
  • RoHS Compliance  Device is RoHS compliant.

Typical Applications

  • Data Center Networking  Used for high-throughput packet processing and aggregation in 1+ Tb/s data center systems where large logic and memory resources are required.
  • Wired Communications  Employed in wired infrastructure and transport systems that need dense I/O and high-bandwidth serial interfaces.
  • Waveform Processing  Suited to waveform generation and real-time signal processing tasks that benefit from large logic capacity and embedded memory.
  • Machine Learning Inference  Applicable to energy-efficient inference workloads as indicated by series-level optimizations for machine learning performance-per-watt.

Unique Advantages

  • High Logic Density: The device’s approximately 2.8M logic elements enable consolidation of large functions into a single FPGA, reducing system complexity.
  • Significant On‑Chip Memory: Roughly 396 Mbits of embedded RAM supports deep buffering and on-chip data processing without immediate dependence on external memory.
  • Dense I/O Footprint: 624 I/Os allow direct interfacing to numerous high-speed peripherals and board-level signals.
  • Extended Temperature Grade: Rated for 0 °C to 100 °C operation, suitable for systems requiring an extended-grade device.
  • Series-Level Integration Options: The UltraScale+ family includes options such as integrated HBM and high-speed transceivers, enabling designs that demand very high memory bandwidth and serial data rates.
  • Design Flow Support: Co-optimization with the Vivado® Design Suite and UltraFAST™ methodology helps streamline development and time to market.

Why Choose XCVU11P-L2FLGF1924E?

The XCVU11P-L2FLGF1924E positions itself for designs that require large logic capacity, substantial embedded memory, and a high I/O count in a compact 1924-FCBGA package. As part of the Virtex UltraScale+ family, it benefits from architecture and toolchain features aimed at improving system-level performance-per-watt and enabling high-bandwidth applications.

This device is well suited for engineers building scalable, high-throughput systems—especially in data center, wired communications, and waveform processing domains—where the combination of logic resources, embedded memory, and dense I/O simplifies system architecture and reduces component count.

Request a quote or contact sales to discuss pricing, availability, and integration support for the XCVU11P-L2FLGF1924E.

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