XCVU125-2FLVB1760E

The XCVU125-2FLVB1760E is a Virtex® UltraScale™ field programmable gate array (FPGA) manufactured by AMD. It provides a high-density programmable fabric with a large on-chip memory footprint and significant I/O capacity for complex digital designs. This device is suited for applications that require substantial logic resources, embedded memory, and high I/O count within a 1760-FCBGA package.

Key Features

• Logic Capacity 1,566,600 logic elements for implementing large, parallel digital designs and custom hardware accelerators.
• Embedded Memory Approximately 90.7 Mbits of on-chip RAM to support buffering, data processing, and algorithm state storage.
• I/O Density 702 I/O pins to interface with a wide range of external peripherals, high-speed buses, and multi-channel systems.
• Package 1760-FCBGA package (42.5 × 42.5 mm) / 1760-BBGA, FCBGA offering a high-pin-count, surface-mount form factor for compact, high-density board designs.
• Power Supply Range Core voltage supply range of 922 mV to 979 mV to match platform power delivery designs.
• Operating Conditions & Grade Extended grade device rated for operation from 0 °C to 100 °C, enabling use in a range of commercial and slightly elevated-temperature environments.
• Mounting Surface mount device for modern PCB assembly and automated manufacturing processes.
• Environmental Compliance RoHS compliant for alignment with common environmental and manufacturing requirements.

Unique Advantages

• High logic density: Large pool of 1,566,600 logic elements enables complex SoC-style implementations without external FPGA expansion.
• Substantial on-chip RAM: Approximately 90.7 Mbits of embedded memory reduces dependence on external memory for many buffering and state-storage needs.
• Extensive I/O capability: 702 I/Os allow direct connection to multiple high-bandwidth interfaces and parallel peripheral channels.
• Compact high-pin package: 1760-FCBGA (42.5 × 42.5 mm) consolidates high connectivity into a manageable PCB footprint.
• Extended-grade operation: Rated 0 °C to 100 °C, suitable for designs targeting extended commercial temperature ranges.
• Regulatory friendliness: RoHS compliance simplifies integration into products with environmental material restrictions.

Why Choose XCVU125-2FLVB1760E?

The XCVU125-2FLVB1760E combines a very large quantity of logic elements, substantial embedded memory, and a high I/O count in a single 1760-FCBGA package. Its extended grade and defined core voltage range make it a practical choice for designers who need significant programmable resources and a compact, high-pin-count footprint.

This device is appropriate for development teams and product designs that require scalable logic capacity, ample on-chip RAM, and broad I/O connectivity while maintaining compliance with RoHS requirements. It offers a clear platform for complex FPGA-based implementations where integration density and resource availability are primary considerations.

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