XCVU125-2FLVB2104I

The XCVU125-2FLVB2104I is a Virtex® UltraScale™ field programmable gate array (FPGA) manufactured by AMD. It provides a high-density programmable logic platform with a large complement of logic elements, embedded memory, and I/O resources targeted at industrial-grade designs.

Key on-chip resources include approximately 1,566,600 logic elements, roughly 90.7 Mbits of embedded memory, and 702 I/O pins, all packaged in a 2104-FCBGA (47.5 × 47.5 mm) surface-mount package and rated for an operating range of –40 °C to 100 °C.

Key Features

• Logic Density  Approximately 1,566,600 logic elements to support large, complex digital designs.
• Embedded Memory  Approximately 90.7 Mbits of on-chip RAM for buffering, state storage, and data processing tasks.
• I/O Capacity  702 I/O pins to accommodate high-pin-count interfacing and multi-channel connectivity.
• Package and Mounting  2104-FCBGA package (47.5 × 47.5 mm) with surface-mount mounting type for high-density board integration.
• Power Supply Range  Core voltage supply range from 922 mV to 979 mV, allowing designs to target the specified operating window.
• Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C to meet industrial-environment requirements.
• Regulatory Compliance  RoHS compliant for alignment with lead-free and hazardous-materials requirements.

Typical Applications

• Industrial control systems  Designs that require industrial temperature capability (–40 °C to 100 °C) combined with extensive I/O for sensor and actuator interfacing.
• High-density programmable logic  Applications demanding large logic capacity and substantial on-chip RAM—benefiting from approximately 1,566,600 logic elements and ~90.7 Mbits of embedded memory.
• I/O-intensive interface and bridging  Systems that need many external connections can leverage up to 702 I/O pins in a 2104-FCBGA package for compact board layouts.

Unique Advantages

• High logic and memory integration: Combines approximately 1,566,600 logic elements with about 90.7 Mbits of embedded RAM to consolidate complex functions on a single device.
• Large I/O support: 702 I/O pins enable multi-channel interfacing and reduce the need for external hub devices.
• Industrial-grade thermal range: Rated from –40 °C to 100 °C to support deployments in demanding environmental conditions.
• Compact, high-density package: 2104-FCBGA (47.5 × 47.5 mm) surface-mount package provides a balance of pin count and board-area efficiency.
• Design compliance: RoHS compliance supports lead-free manufacturing and regulatory alignment.

Why Choose XCVU125-2FLVB2104I?

The XCVU125-2FLVB2104I positions itself as a high-capacity, industrial-grade FPGA option from AMD's Virtex® UltraScale™ family, combining extensive logic resources, significant embedded memory, and a large I/O complement in a single 2104-FCBGA package. Its operating voltage and temperature range, together with RoHS compliance, make it a practical choice for engineers building robust, high-density programmable systems.

This device is suited for designs that require scalability of logic and memory resources, a high number of I/Os, and an industrial operating envelope—offering a compact platform for integrating complex digital functions while aligning with industry lead-free requirements.

Request a quote for the XCVU125-2FLVB2104I to check availability and pricing, or submit a quote request to discuss how this FPGA fits your project requirements.