XCVU125-2FLVB2104E

The XCVU125-2FLVB2104E is a Virtex® UltraScale™ Field Programmable Gate Array (FPGA) IC from AMD packaged in a 2104-FCBGA (47.5 × 47.5 mm) footprint. It delivers a high-density, programmable logic fabric with substantial on-chip memory and a large I/O count for complex, configurable digital designs.

Designed for applications that require extensive logic, embedded memory and high I/O connectivity, this device offers a combination of scale and integration while operating within a core voltage range of 922 mV to 979 mV and an operating temperature range of 0 °C to 100 °C.

Key Features

• Logic Capacity  Approximately 1,566,600 logic elements enabling large-scale programmable logic implementations.
• Embedded Memory  Approximately 90.7 Mbits of on-chip RAM to support buffering, LUT-based memory and data-intensive processing.
• I/O Connectivity  702 user I/Os to accommodate wide parallel interfaces and high-pin-count system connections.
• Core Voltage  Specified core voltage range from 922 mV to 979 mV for power domain planning and regulator selection.
• Package & Mounting  2104-BBGA FCBGA package, surface-mount; supplier device package dimension 2104-FCBGA (47.5 × 47.5 mm) for PCB footprint planning.
• Operating Range & Grade  Extended grade with an operating temperature range of 0 °C to 100 °C suitable for a range of commercial and extended-temperature applications.
• Standards  RoHS compliant.

Typical Applications

• High-density programmable logic  Implement complex digital logic functions and custom accelerators using the device’s large logic and memory resources.
• Data buffering and on-chip memory tasks  Use the approximately 90.7 Mbits of embedded RAM for intermediate storage, FIFOs and data path staging.
• High-pin-count system integration  Leverage 702 I/Os to interface with multiple peripherals, sensors, and high-throughput data paths.

Unique Advantages

• High logic density: The approximately 1.57 million logic elements support large, consolidated designs and reduce the need for multi-device partitioning.
• Substantial on-chip memory: Approximately 90.7 Mbits of RAM lets designers implement complex buffering and memory-intensive algorithms without external RAM.
• Extensive I/O resources: 702 I/Os provide flexibility for parallel interfaces, multi-channel data acquisition, and broad system connectivity.
• Compact FCBGA package: 2104-FCBGA (47.5 × 47.5 mm) provides a high-pin-count solution in a defined PCB footprint for dense system layouts.
• Defined power envelope: Core voltage specified between 922 mV and 979 mV enables precise power supply design and regulation choices.
• Extended operating range: Extended grade with 0 °C to 100 °C operation supports deployments across a range of environmental conditions.

Why Choose XCVU125-2FLVB2104E?

The XCVU125-2FLVB2104E from AMD combines large logic capacity, significant embedded memory and a high I/O count in a single 2104-FCBGA package, offering integration and scalability for demanding programmable logic projects. Its specified core voltage range and extended operating temperature make it suitable for designs that require defined power planning and operation across typical commercial-to-extended thermal environments.

This device is well suited for engineers and system designers building complex digital systems that need consolidated logic, on-chip memory resources and broad connectivity while maintaining a compact package footprint.

Request a quote or submit an inquiry to discuss availability, pricing and lead times for the XCVU125-2FLVB2104E. Our team can provide the details you need to evaluate this device for your next design.