XCVU125-2FLVC2104E

The XCVU125-2FLVC2104E is a Virtex® UltraScale™ Field Programmable Gate Array (FPGA) from AMD, offered in a 2104-FCBGA package. It delivers very high on-chip resources, including 1,566,600 logic elements and approximately 90.7 Mbits of embedded memory, for complex programmable logic implementations.

With 416 I/O pins, an extended-grade operating range, and a compact 2104-BBGA footprint (47.5 mm × 47.5 mm), this device targets designs that need large programmable fabric and substantial embedded memory within a surface-mount, RoHS-compliant package.

Key Features

• Core Fabric  1,566,600 logic elements and 89,520 CLBs provide a high-density programmable logic foundation for complex designs.
• Embedded Memory  Approximately 90.7 Mbits of on-chip RAM bits support large buffering, state storage, and memory-intensive functions.
• I/O Capacity  416 configurable I/O pins allow extensive peripheral, interface, and board-level connectivity.
• Package  2104-BBGA / 2104-FCBGA (47.5 mm × 47.5 mm) surface-mount package suitable for high-density board integration.
• Power  Core supply operating range from 922 mV to 979 mV to match system power rails and design constraints.
• Temperature & Grade  Extended-grade device with an operating temperature range of 0 °C to 100 °C for a wide set of commercial and industrial-adjacent environments.
• Compliance  RoHS compliant, meeting standard lead-free and material requirements.
• Mounting  Surface-mount package for modern PCB assembly processes.

Typical Applications

• High-density compute and prototyping  Use the large logic capacity and abundant embedded memory to implement complex algorithms, parallel processing blocks, or hardware prototypes.
• Data buffering and packet processing  The substantial on-chip RAM supports buffering, queues, and memory-intensive packet operations.
• Multi-interface system integration  416 I/O pins enable aggregation of multiple peripheral interfaces and board-level signals in a single programmable device.

Unique Advantages

• High logic density: 1,566,600 logic elements allow consolidation of complex functions into a single FPGA, reducing BOM complexity.
• Large embedded memory: Approximately 90.7 Mbits of on-chip RAM support large data sets and reduce external memory dependency.
• Broad I/O count: 416 I/O pins provide flexibility for multi-channel designs and extensive peripheral connectivity.
• Compact, manufacturable package: 2104-FCBGA (47.5 mm × 47.5 mm) surface-mount package simplifies PCB layout for high-density systems.
• Extended operating range: Extended-grade rating and 0 °C to 100 °C operating temperature accommodate a range of deployment environments.
• RoHS compliant: Material compliance facilitates adherence to common environmental regulations.

Why Choose XCVU125-2FLVC2104E?

The XCVU125-2FLVC2104E positions itself as a high-resource, programmable logic solution combining a very large logic fabric, substantial embedded memory, and a high I/O count in a single 2104-FCBGA surface-mount package. Its extended-grade temperature rating and RoHS compliance make it suitable for demanding designs that require scalable on-chip resources and manufacturable packaging.

This device is well suited for engineers and system designers who need to consolidate complex functions, large buffers, or multi-interface logic into a single FPGA while maintaining a compact board footprint and standard assembly compatibility.

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