XCVU13P-1FHGB2104E

The XCVU13P-1FHGB2104E is a Virtex® UltraScale+™ field programmable gate array (FPGA) IC from AMD, supplied in a 2104-FCBGA (52.5 × 52.5 mm) package. It delivers very high programmable logic capacity, large on‑chip RAM, and a high I/O count for designs requiring extensive integration of custom logic and data paths.

Specified for surface-mount assembly and RoHS compliance, this device supports systems operating within a 0 °C to 100 °C temperature range and a core supply voltage between 825 mV and 876 mV.

Key Features

• Logic Capacity  Provides 3,780,000 logic elements to implement large-scale programmable logic, custom datapaths, and complex state machines.
• Embedded Memory  Approximately 515 Mbits of on‑chip RAM to store buffers, tables, and intermediate data without external memory for many use cases.
• I/O Density  Up to 702 user I/O pins to interface with multiple peripherals, high-speed links, and board-level interfaces.
• Package and Mounting  2104-FCBGA package (52.5 × 52.5 mm) in a surface-mount format, providing a compact, high-pin-count footprint for PCB integration.
• Power  Core supply voltage range of 825 mV to 876 mV to match system power rails and enable predictable power budgeting.
• Operating Environment  Extended grade device with an operating temperature range of 0 °C to 100 °C for a wide range of commercial and extended-temperature applications.
• Regulatory  RoHS compliant.

Typical Applications

• High‑capacity programmable logic  Large logic element count supports implementation of complex custom processing, protocol offload, and control logic within a single device.
• On‑chip buffering and data staging  Nearly 515 Mbits of embedded memory enables local storage for packet buffering, look-up tables, and temporary data handling.
• Multi‑interface system integration  Up to 702 I/O pins facilitate integration of multiple external interfaces and peripheral subsystems on the same PCB.

Unique Advantages

• High logic density: The 3,780,000 logic elements reduce the need for multiple FPGAs or external ASICs when implementing large designs.
• Substantial on‑chip memory: Approximately 515 Mbits of embedded RAM minimizes reliance on external memory for many buffering and state‑storage tasks.
• Extensive I/O capability: 702 I/O pins provide flexibility for complex board-level connectivity and high fanout designs.
• Compact high‑pin package: The 2104-FCBGA (52.5 × 52.5 mm) package concentrates functionality in a single, surface-mount footprint for dense PCB layouts.
• Predictable power envelope: Defined core supply range (825 mV–876 mV) aids in system power planning and regulator selection.
• Extended temperature support: 0 °C to 100 °C operating range supports a broad set of deployment environments.

Why Choose XCVU13P-1FHGB2104E?

The XCVU13P-1FHGB2104E positions itself for designs that require large programmable logic resources, significant on‑chip memory, and a high count of I/O in a single FPGA package. Its combination of 3,780,000 logic elements, approximately 515 Mbits of embedded RAM, and 702 I/O pins enables consolidation of complex functionality and reduces board-level component count.

This extended‑grade, RoHS‑compliant device in a 2104-FCBGA package is suited to engineering teams seeking high integration density and a predictable power and thermal envelope for commercial and extended-temperature applications.

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