XCVU13P-1FHGB2104I

The XCVU13P-1FHGB2104I is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC designed for industrial applications that require very large logic capacity, extensive embedded memory, and a high I/O count. Its architecture delivers a combination of logic resources, on-chip RAM, and I/O density in a high-pin-count FCBGA package.

Key Features

• Logic Capacity — 3,780,000 logic elements and 216,000 CLBs provide substantial programmable fabric for complex digital designs.
• Embedded Memory — Approximately 514.9 Mbits of on-chip RAM to support large buffering, data storage, and intermediate processing requirements.
• I/O Density — 702 available I/O pins to support extensive peripheral, sensor, and interface connectivity.
• Power Supply — Supports a core supply range of 825 mV to 876 mV, enabling designs that target this specific voltage window.
• Package & Mounting — Supplied in a 2104-BBGA / 2104-FCBGA package (2104-FCBGA (52.5×52.5)) with surface-mount mounting for high-density board integration.
• Industrial Grade & Temperature Range — Industrial grade device rated for operation from −40 °C to 100 °C for use in temperature-demanding environments.
• Regulatory Compliance — RoHS compliant for materials and environmental considerations.

Typical Applications

• Industrial Control Systems — Large logic capacity and high I/O count enable complex control algorithms, real-time processing, and multiple sensor/actuator interfacing.
• Data Processing and Acceleration — Extensive on-chip RAM and abundant logic elements support buffering and parallel processing tasks within acceleration pipelines.
• Communications and Infrastructure — High I/O density and configurable fabric allow implementation of protocol handling and interface aggregation in infrastructure equipment.

Unique Advantages

• High Logic Integration: 3,780,000 logic elements and 216,000 CLBs enable large or multi-function FPGA designs without immediate need for multiple devices.
• Substantial On-Chip Memory: Approximately 514.9 Mbits of embedded memory reduces reliance on external RAM for many buffering and state-storage use cases.
• Extensive I/O Capability: 702 I/O pins support wide peripheral integration and multiple high-density interfaces on a single device.
• Industrial Temperature Range: Specified operation from −40 °C to 100 °C provides suitability for temperature-challenging installations.
• Surface-Mount, High-Pin Package: 2104-FCBGA packaging with surface-mount mounting supports compact, high-density PCB layouts.
• RoHS Compliant: Meets lead-free and restricted-substance considerations for modern manufacturing and procurement.

Why Choose XCVU13P-1FHGB2104I?

The XCVU13P-1FHGB2104I positions itself for designs that require a large, integrated FPGA fabric with significant on-chip memory and extensive I/O in an industrial-grade device. Its combination of logic elements, embedded RAM, and I/O count supports complex, high-density system integration while the specified operating temperature range and RoHS compliance address environmental and regulatory considerations.

This device is suitable for engineering teams building industrial control, data processing, or communications hardware that need scalable programmable logic resources and a high level of on-chip integration.

Request a quote or submit an inquiry to receive pricing, availability, and procurement details for the XCVU13P-1FHGB2104I.