XCVU13P-2FHGA2104E

The XCVU13P-2FHGA2104E is an AMD Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) supplied in a 2104-FCBGA package. It delivers high programmable logic capacity and substantial on-chip memory within a surface-mount BGA footprint.

Key device attributes include 3,780,000 logic elements, approximately 515 Mbits of embedded memory, 832 I/Os, and a documented operating voltage window and temperature range suited to extended-grade installations.

Key Features

• Logic Capacity — 3,780,000 logic elements providing large programmable fabric for complex designs; the device also lists 216,000 CLBs.
• Embedded Memory — Total on-chip RAM of 514,867,200 bits (approximately 515 Mbits) to support buffering, frame storage, and on-chip data structures.
• I/O Count — 832 user I/Os to enable extensive peripheral, board-level, and mezzanine connectivity.
• Package and Mounting — 2104-FCBGA (52.5x52.5) supplier device package in a surface-mount FCBGA format suitable for compact, high-density board designs.
• Power Supply Range — Documented core supply range of 825 mV to 876 mV for predictable power planning and supply design.
• Operating Conditions & Grade — Extended grade with an operating temperature range of 0 °C to 100 °C for a wide set of commercial and extended-environment applications.
• Compliance — RoHS compliant to align with lead-free restrictions in applicable assemblies.

Typical Applications

• High-density processing systems — Use the device where very large programmable logic capacity and substantial embedded memory are required for on-chip data paths and acceleration.
• I/O-intensive designs — Leverage 832 I/Os for applications requiring extensive parallel interfaces, multi-lane connectivity, or dense board-level interconnect.
• Compact, high-performance boards — The 2104-FCBGA surface-mount package supports compact board layouts that need significant logic and memory in a single device footprint.

Unique Advantages

• High programmable capacity: 3,780,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing component count on the bill of materials.
• Substantial on-chip memory: Approximately 515 Mbits of embedded RAM supports large buffers, frame storage, and data staging without external memory in some designs.
• Extensive I/O: 832 I/Os allow flexible partitioning of external interfaces, simplifying board routing and enabling dense connectivity options.
• Compact BGA package: The 2104-FCBGA footprint delivers high integration density for space-constrained systems while maintaining surface-mount assembly compatibility.
• Predictable power envelope: Defined core voltage range (825 mV–876 mV) assists in power-supply selection and thermal budgeting during system design.
• Extended-grade operating range: 0 °C to 100 °C rating provides a clear thermal operating window for a range of commercial and extended-environment applications.

Why Choose XCVU13P-2FHGA2104E?

The XCVU13P-2FHGA2104E positions itself as a high-density, high-memory FPGA option within the Virtex® UltraScale+™ family, combining millions of logic elements, hundreds of megabits of embedded RAM, and a large I/O count in a single 2104-FCBGA package. These characteristics make it suitable for designs that prioritize programmable capacity, on-chip memory resources, and extensive connectivity.

For projects that require consolidation of complex logic, significant on-chip buffering, and dense external interfacing in a surface-mount form factor, this device provides a balance of integration and predictable electrical and thermal parameters to support system-level planning.

Request a quote or submit a sales inquiry to obtain pricing, availability, and additional procurement information for the XCVU13P-2FHGA2104E.