XCVU13P-1FSGA2577E

The XCVU13P-1FSGA2577E is a Virtex® UltraScale+™ field programmable gate array (FPGA) in a 2577-FCBGA package. It provides large on-chip resources including millions of logic elements, tens of millions of bits of embedded memory, and a high I/O count for dense system integration.

Designed for applications that require significant logic capacity, substantial embedded memory, and numerous external interfaces, this device delivers integration and flexibility while operating within a low-voltage supply range and an extended temperature window.

Key Features

• Core (Logic Capacity) 3,780,000 logic elements and 216,000 CLBs provide extensive programmable logic resources for large designs and complex implementations.
• Embedded Memory Approximately 99.09 Mbits of on-chip RAM to support wide data buffering, lookup tables, and memory-intensive functions without relying on external memory.
• I/O Resources 448 user I/O pins to support multiple external interfaces and high pin-count system connections.
• Power Supported core supply range from 825 mV to 876 mV, enabling operation within a defined low-voltage domain.
• Package & Mounting 2577-FCBGA package (52.5 × 52.5 mm) in a surface-mount form factor for high-pin-count board-level integration.
• Temperature & Grade Extended grade device with an operating temperature range of 0 °C to 100 °C for applications requiring this operating window.
• Compliance RoHS compliant.

Typical Applications

• High-density FPGA designs — Use the device’s multi-million logic-element capacity and abundant CLBs for large-scale programmable logic implementations and complex digital processing.
• Memory-intensive functions — Approximately 99.09 Mbits of embedded RAM enable on-chip buffering, caching, and lookup-table storage to reduce external memory dependencies.
• I/O-rich systems — With 448 I/O pins, the device supports designs that require many external interfaces or parallel data paths.
• Board-level integration — The 2577-FCBGA surface-mount package supports compact, high-pin-count PCB designs where consolidation of functionality is required.

Unique Advantages

• Large programmable fabric: 3,780,000 logic elements and 216,000 CLBs enable implementation of complex logic and deep datapaths on a single device.
• Substantial on-chip memory: Approximately 99.09 Mbits of embedded RAM reduces reliance on external memory and simplifies system designs.
• High I/O density: 448 I/O pins provide flexibility for connecting multiple interfaces and high-bandwidth signals.
• Compact, high-pin-count package: 2577-FCBGA (52.5 × 52.5 mm) offers a surface-mount solution for dense board layouts.
• Controlled low-voltage core operation: Operates within a defined 825 mV to 876 mV supply range to match system power domains.
• Extended grade operation: Rated for 0 °C to 100 °C to meet designs targeting this operating window.

Why Choose XCVU13P-1FSGA2577E?

The XCVU13P-1FSGA2577E positions itself as a high-capacity, highly integrated FPGA option within the Virtex® UltraScale+™ family from AMD, offering large logic and memory resources alongside a high I/O count in a single FCBGA package. Its specification set supports consolidation of complex logic, substantial on-chip buffering, and numerous external connections while operating in a defined low-voltage range and extended temperature window.

This device is suited for design teams and procurement looking for an FPGA that delivers significant programmable resources and embedded memory for dense system integration and reduced external component count.

Request a quote or submit a parts inquiry to obtain pricing and availability for the XCVU13P-1FSGA2577E and discuss your design requirements.