XCVU13P-2FHGB2104E

The XCVU13P-2FHGB2104E is a Virtex® UltraScale+™ field programmable gate array (FPGA) IC supplied in a 2104-FCBGA package. It provides very large programmable logic capacity, substantial on-chip memory, and a high count of I/O suitable for complex FPGA designs.

Designed for applications that require extensive logic resources, large embedded memory, and broad I/O integration, this extended-grade device delivers a compact surface-mount package and defined operating and supply ranges for system integration.

Key Features

• Core Logic  Approximately 3,780,000 logic elements to support large-scale programmable designs and complex logic implementations.
• Embedded Memory  Approximately 515 Mbits of embedded memory (514,867,200 total RAM bits) for on-chip data storage, buffering, and state retention.
• I/O Capacity  702 I/O pins enabling extensive external interfacing and connectivity for multi-channel systems.
• Package and Mounting  2104-BBGA / 2104-FCBGA package (supplier device package: 2104-FCBGA (52.5x52.5)), surface-mount construction for compact PCB integration.
• Power  Specified core supply range from 0.825 V to 0.876 V for system power planning and regulator selection.
• Temperature and Grade  Extended grade with an operating temperature range of 0°C to 100°C to match typical commercial/extended temperature designs.
• Compliance  RoHS compliant to support regulatory and environmental requirements.

Typical Applications

• Complex FPGA designs  Suited for projects that demand millions of logic elements combined with large on-chip memory and extensive I/O.
• High-density integration  Used where board space and package density are critical, leveraging the 2104-FCBGA surface-mount footprint.
• Memory-intensive functions  Appropriate for designs requiring substantial embedded RAM for buffering, look-up tables, and data handling.

Unique Advantages

• High logic capacity: Enables implementation of very large, complex designs without external programmable logic.
• Substantial on-chip memory: Approximately 515 Mbits of embedded RAM reduces dependence on off-chip memory and simplifies routing.
• Extensive I/O: 702 I/O pins provide flexibility for supporting multiple interfaces and parallel channels.
• Compact FCBGA packaging: 2104-FCBGA (52.5x52.5) allows dense system integration on space-constrained PCBs.
• Defined power envelope: Core supply range of 0.825 V to 0.876 V aids in precise power-supply and thermal design.
• Extended-grade rating: Rated 0°C to 100°C to meet use cases that require operation across a wider-than-standard commercial temperature span.

Why Choose XCVU13P-2FHGB2104E?

The XCVU13P-2FHGB2104E positions itself as a high-capacity programmable logic device offering a combination of millions of logic elements, roughly 515 Mbits of embedded memory, and 702 I/O pins in a 2104-FCBGA surface-mount package. These attributes make it well-suited for engineers building large-scale, memory- and I/O-intensive FPGA designs that require a compact, extended-grade component.

With clearly specified supply and thermal ranges and RoHS compliance, this device supports predictable integration into systems where extensive programmable logic and on-chip memory are primary design drivers.

Request a quote or contact sales to check availability, pricing, and to submit a purchase inquiry for XCVU13P-2FHGB2104E.