XCVU13P-2FIGD2104E

The XCVU13P-2FIGD2104E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD. It delivers a very large programmable fabric with 3,780,000 logic elements and approximately 515 Mbits of embedded memory, supporting designs that require substantial on-chip logic and storage capacity.

Packaged in a 2104-FCBGA (52.5 × 52.5 mm) surface-mount package with 676 I/O, this extended-grade device is specified for operation from 0 °C to 100 °C, requires a core voltage supply between 825 mV and 876 mV, and is RoHS compliant.

Key Features

• Core Capacity  Approximately 3,780,000 logic elements for large-scale programmable logic implementations.
• Embedded Memory  Approximately 515 Mbits of on-chip RAM to support buffering, caching, and state storage within the FPGA fabric.
• I/O Density  676 I/O pins to support multiple external interfaces and high pin-count designs.
• Package & Mounting  2104-FCBGA package (52.5 × 52.5 mm) designed for surface-mount assembly in compact, high-pin-count applications.
• Power  Core voltage supply range specified from 825 mV to 876 mV for the device core.
• Temperature & Grade  Extended grade device with an operating temperature range of 0 °C to 100 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density programmable logic systems  Large logic capacity and extensive embedded memory make this FPGA suitable for designs requiring substantial on-chip processing resources.
• Data buffering and on-chip storage  Approximately 515 Mbits of embedded RAM supports applications that need significant internal buffering or state retention.
• I/O-intensive designs  676 I/O pins enable complex interfacing and multi-channel connectivity in compact form factors.

Unique Advantages

• Large programmable fabric: The device’s 3,780,000 logic elements provide significant on-chip logic capacity to consolidate functions previously spread across multiple chips.
• Substantial embedded memory: Approximately 515 Mbits of on-chip RAM reduces dependence on external memory for many buffering and storage tasks.
• High I/O count: 676 I/O pins accommodate complex interface requirements without extensive external multiplexing.
• High-pin-count FCBGA package: The 2104-FCBGA (52.5 × 52.5 mm) package delivers high interconnect density in a surface-mount form factor.
• Defined core voltage range: A specified supply range of 825 mV to 876 mV supports predictable power planning for the FPGA core.
• Extended operating grade and RoHS compliance: Rated 0 °C to 100 °C and RoHS compliant for projects requiring extended-grade components and environmental conformity.

Why Choose XCVU13P-2FIGD2104E?

The XCVU13P-2FIGD2104E positions itself as a high-capacity programmable solution within the Virtex® UltraScale+™ family, combining millions of logic elements, extensive embedded memory, and a high I/O count in a single 2104-FCBGA surface-mount package. Its extended-grade operating range and RoHS compliance provide clarity for designs with defined environmental and regulatory requirements.

This device is suitable for engineering teams and procurement seeking a consolidated, high-density FPGA option from AMD that aligns with designs requiring significant on-chip logic, memory, and I/O capacity while maintaining explicit electrical and thermal specifications.

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