XCVU13P-2FLGA2577I

The XCVU13P-2FLGA2577I is a Virtex® UltraScale+™ field programmable gate array (FPGA) offered in a 2577-ball FCBGA package. It provides a high count of logic elements and substantial on-chip memory in a surface-mount package targeted at industrial-grade applications.

Key hardware characteristics include approximately 3,780,000 logic elements, roughly 515 Mbits of embedded memory, 448 I/O pins, a supply voltage range of 825 mV to 876 mV, and an operating temperature range of −40 °C to 100 °C.

Key Features

• Core Capacity  Approximately 3,780,000 logic elements to support large, complex designs requiring extensive programmable logic.
• Embedded Memory  Approximately 515 Mbits of on-chip RAM for buffering, data storage, and intermediate processing without external memory dependence.
• I/O Resources  448 I/O pins to accommodate high-channel-count interfaces and flexible board-level connectivity.
• Package  2577-ball FCBGA (52.5 × 52.5 mm) surface-mount package that integrates the device into compact board footprints while providing dense I/O and routing.
• Power  Specified supply voltage range of 825 mV to 876 mV for core power sequencing and design planning.
• Temperature and Grade  Industrial grade device rated for operation from −40 °C to 100 °C to meet extended-environment requirements.
• Regulatory  RoHS compliant for lead-free manufacturing and regulatory alignment.

Unique Advantages

• High logic density: The large logic element count enables consolidation of multiple functions onto a single FPGA, reducing system component count.
• Substantial on-chip memory: Approximately 515 Mbits of embedded RAM supports large buffers and data-path implementations without immediate need for external memory.
• Extensive I/O capability: 448 I/O pins provide flexibility for interfacing to multiple peripherals and high-channel-count systems.
• Industrial temperature rating: Operation from −40 °C to 100 °C supports deployment in industrial environments with wide temperature swings.
• Compact FCBGA package: The 2577-ball FCBGA (52.5 × 52.5 mm) offers a dense packaging option for space-constrained board designs while supporting required I/O.
• RoHS compliant: Enables inclusion in lead-free manufacturing flows and aligns with common environmental requirements.

Why Choose XCVU13P-2FLGA2577I?

The XCVU13P-2FLGA2577I positions itself as a high-capacity, industrial-grade Virtex® UltraScale+™ FPGA that brings together a very large logic fabric, significant embedded memory, and extensive I/O in a single FCBGA package. Its specified supply voltage range and −40 °C to 100 °C operating window make it suitable for designs that require robust operation across a wide range of conditions.

This device is well suited for engineering teams looking to consolidate complex digital processing, buffering, and high-channel interfacing into a single programmable device while maintaining compliance with RoHS requirements and surface-mount PCB assembly practices.

Request a quote or contact sales to obtain pricing, lead times, and additional ordering information for the XCVU13P-2FLGA2577I.