XCVU13P-2FIGD2104I

The XCVU13P-2FIGD2104I is a Virtex® UltraScale+™ field programmable gate array IC designed for applications that need large programmable logic capacity and extensive I/O. It implements a high count of configurable logic resources and embedded memory to support complex, custom digital designs.

This device is supplied in a 2104-FCBGA (52.5×52.5 mm) surface-mount package, rated for industrial operation with a specified core supply range and wide operating temperature window for deployment in demanding environments.

Key Features

• Logic Capacity — 3,780,000 logic elements providing extensive programmable fabric for complex digital functions and custom hardware acceleration.
• Configurable Logic Blocks (CLBs) — 216,000 CLBs to structure and partition designs across a large FPGA fabric.
• Embedded Memory — Approximately 515 Mbits of on-chip RAM to support buffering, large lookup tables, and state storage without external memory.
• I/O Density — 676 user I/O pins to accommodate high channel counts and diverse interface requirements.
• Power Domain — Core voltage supply range of 825 mV to 876 mV, enabling defined power planning for the FPGA core.
• Package and Mounting — 2104-BBGA / 2104-FCBGA package (52.5×52.5 mm) in a surface-mount form factor for board-level integration.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Compliance — RoHS-compliant construction for regulatory alignment in many regions.

Typical Applications

• High-density digital processing — Use the large logic element count and CLB resources to implement custom digital signal flows and hardware-accelerated algorithms.
• Memory-intensive designs — Leverage approximately 515 Mbits of embedded RAM for large on-chip buffering, packet queues, or lookup tables.
• I/O-heavy systems — Employ the 676 I/O pins to connect to multiple sensors, interfaces, or parallel channels without immediate need for external multiplexing.

Unique Advantages

• Massive programmable fabric: 3,780,000 logic elements and 216,000 CLBs provide capacity to consolidate multiple functions onto a single device, reducing system BOM and board area.
• Substantial on-chip memory: Approximately 515 Mbits of RAM supports large data buffers and state machines while minimizing dependence on external memory components.
• High I/O count: 676 user I/O pins simplify integration with many peripherals and high-channel-count front ends.
• Industrial operating range: −40 °C to 100 °C rating enables deployment in harsher environments where extended temperature tolerance is required.
• Defined power window: A core supply range of 825 mV to 876 mV helps with precise power sequencing and thermal/power planning during system design.
• Surface-mount FCBGA package: 2104-FCBGA (52.5×52.5 mm) offers a compact, board-mountable solution for high-density FPGA integration.

Why Choose XCVU13P-2FIGD2104I?

The XCVU13P-2FIGD2104I positions itself as a high-capacity, industrial-grade FPGA suited to designers who need extensive programmable logic, abundant embedded memory, and a large I/O footprint in a single package. Its combination of millions of logic elements, hundreds of thousands of CLBs, and roughly 515 Mbits of on-chip RAM enables consolidation of complex functions and reduces dependence on external components.

For engineering teams building scalable, I/O-rich systems in industrial environments, this device offers a clear hardware foundation with verifiable electrical and environmental specifications to support reliable designs over the long term.

Request a quote or submit a procurement inquiry to receive pricing and availability information for the XCVU13P-2FIGD2104I. Our team can provide the details needed to move your design forward.