XCVU13P-2FSGA2577E

The XCVU13P-2FSGA2577E is a Virtex® UltraScale+™ field programmable gate array (FPGA) IC delivered in a 2577-FCBGA package. It combines a very large logic fabric and embedded memory capacity with a high count of I/O for dense, programmable digital designs.

With 3,780,000 logic elements and approximately 99 Mbits of on-chip RAM, this extended-grade, surface-mount FPGA targets designs that require substantial logic resources, high memory bandwidth, and broad I/O integration while operating within a 0 °C to 100 °C temperature range.

Key Features

• Core Logic 3,780,000 logic elements and 216,000 CLBs provide extensive programmable logic capacity for large-scale digital implementations.
• Embedded Memory Approximately 99 Mbits of on-chip RAM to support memory-intensive functions and buffering close to the logic fabric.
• I/O Density 448 user I/O pins to support broad peripheral connectivity and multi-channel data interfaces.
• Power Supported supply voltage range from 825 mV to 876 mV to match platform power-rail requirements.
• Package & Mounting 2577-BBGA (2577-FCBGA, 52.5 × 52.5 mm) surface-mount package for high-density board integration.
• Operating Range & Grade Extended grade with an operating temperature range of 0 °C to 100 °C.
• Compliance RoHS compliant for environmental materials requirements.

Typical Applications

• Large-scale programmable systems — Designs that require millions of logic elements and substantial embedded memory for complex control, processing, or custom compute pipelines.
• High-density I/O subsystems — Systems that need hundreds of I/O lines for multi-channel interfacing, aggregation, or protocol bridging.
• Memory‑intensive algorithms — Implementations that benefit from approximately 99 Mbits of on-chip RAM for buffering, look-up tables, and state storage.

Unique Advantages

• Massive logic capacity: 3,780,000 logic elements enable highly parallel or deeply pipelined designs without partitioning across multiple devices.
• Substantial on-chip memory: Approximately 99 Mbits of embedded RAM reduces external memory dependence and lowers system latency.
• High I/O count: 448 I/O pins provide flexibility to connect numerous peripherals, transceivers, and external interfaces on a single device.
• Compact, high-density packaging: 2577-FCBGA (52.5 × 52.5 mm) package supports a dense board footprint for space-constrained systems.
• Extended-grade operation: 0 °C to 100 °C rating makes the device suitable for applications with elevated ambient ranges within that window.
• RoHS compliance: Meets lead-free materials requirements for environmental regulatory alignment.

Why Choose XCVU13P-2FSGA2577E?

The XCVU13P-2FSGA2577E positions itself as a high-capacity programmable platform combining millions of logic elements, large embedded memory, and hundreds of I/O in a single extended-grade FCBGA package. It is suitable for engineering teams building complex, memory- and I/O-heavy digital systems that require integration and scalability on a single FPGA device.

Designed for applications that demand dense logic resources and substantial on-chip RAM while operating within a defined supply and temperature range, this FPGA delivers a balanced mix of performance, integration, and manufacturability for long-term designs backed by a vendor ecosystem.

Request a quote or submit an inquiry today to receive pricing and availability information for the XCVU13P-2FSGA2577E.