XCVU13P-3FHGB2104E

The XCVU13P-3FHGB2104E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC by AMD. It provides a high count of programmable logic resources, substantial on-chip memory, and a large number of I/O pins in a 2104-FCBGA package.

This device is suited to designs that require a large number of logic elements, significant embedded memory capacity, and dense I/O connectivity, while operating within a 0°C to 100°C range and a supply voltage window of 873 mV to 927 mV.

Key Features

• Programmable Logic Approximately 3,780,000 logic elements to implement complex, high-density digital logic.
• Embedded Memory Approximately 514.9 Mbits of on-chip RAM to support large buffers, FIFOs, and memory-intensive functions.
• I/O Capacity 702 I/O pins for extensive peripheral and interconnect options across system interfaces.
• Package and Mounting 2104-BBGA FCBGA package (supplier device package: 2104-FCBGA (52.5x52.5)) in a surface-mount form factor for board-level integration.
• Power Voltage supply range from 873 mV to 927 mV, enabling precise power domain planning.
• Operating Range and Grade Rated for operation from 0°C to 100°C and designated as Extended grade for broader commercial deployment.
• Compliance RoHS compliant, supporting regulatory requirements for hazardous substance reduction.

Typical Applications

• High-density programmable logic — Implements complex custom logic and algorithm acceleration where large numbers of logic elements are required.
• Memory-intensive designs — Uses the device’s substantial on-chip RAM for buffering, packet processing, and large FPGA-resident data structures.
• High I/O systems — Leverages 702 I/O pins for multi-channel interfaces, sensor arrays, or dense board-level connectivity.
• Prototyping and system integration — Surface-mount 2104-FCBGA package supports integration into advanced prototype and production boards.

Unique Advantages

• Large logic capacity: Approximately 3.78 million logic elements enable implementation of highly parallel and complex designs without partitioning.
• Substantial on-chip memory: Approximately 514.9 Mbits of embedded RAM reduces external memory dependence and simplifies data-path design.
• Extensive I/O: 702 I/O pins provide flexibility for high-bandwidth and multi-interface systems, minimizing the need for external multiplexing.
• Compact, high-density packaging: 2104-FCBGA package supports dense implementations while remaining surface-mountable for standard PCB assembly processes.
• Clear operating and power boundaries: Defined operating temperature (0°C to 100°C) and supply range (873 mV–927 mV) aid in system-level thermal and power planning.
• Regulatory compliance: RoHS compliance helps meet environmental and manufacturing regulations.

Why Choose XCVU13P-3FHGB2104E?

The XCVU13P-3FHGB2104E positions itself as a high-capacity, memory-rich FPGA solution for designs that demand extensive programmable logic, large embedded memory, and substantial I/O. Its Extended grade and defined thermal and voltage ranges make it suitable for a wide set of commercial and advanced electronic applications where these specific hardware characteristics are required.

Engineers and procurement teams seeking a single-chip option that combines high logic density, significant on-chip RAM, and broad I/O connectivity will find this device aligns with systems that prioritize integration, reduced external components, and predictable power/thermal planning.

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