XCVU13P-2FSGA2577I

The XCVU13P-2FSGA2577I is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) provided in a 2577-ball FCBGA package. It offers a very high count of programmable logic and embedded memory, paired with a large I/O complement and an industrial operating temperature range.

Key device attributes include 3,780,000 logic elements, approximately 99 Mbits of embedded memory, 448 I/Os, a 2577-FCBGA (52.5 × 52.5 mm) package, and an operating temperature range of −40 °C to 100 °C. The device is RoHS compliant and is designed for surface-mount assembly with a specified core supply range of 825 mV to 876 mV.

Key Features

• Logic Resources  3,780,000 logic elements provide extensive programmable fabric for complex digital designs.
• Configurable Logic Blocks (CLBs)  216,000 CLBs for fine-grained logic implementation and routing flexibility.
• Embedded Memory  Approximately 99 Mbits of on-chip RAM to support large buffering, state storage, and data-path implementations.
• High I/O Count  448 I/Os to accommodate wide bus interfaces, multiple peripherals, and high-pin-count system integration.
• Power Supply  Core supply specified between 825 mV and 876 mV to match targeted system power domains and regulator designs.
• Package and Mounting  2577-FCBGA package (52.5 × 52.5 mm) optimized for surface-mount assembly in high-density system boards.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Environmentally Compliant  RoHS compliant to meet environmental and manufacturing requirements.

Unique Advantages

• Very high programmable capacity: The combination of 3,780,000 logic elements and 216,000 CLBs enables complex hardware implementations without immediate need for external logic expansion.
• Significant on-chip memory: Approximately 99 Mbits of embedded RAM reduces dependence on off-chip memory for buffering and state retention, simplifying board design.
• Extensive I/O connectivity: 448 I/Os support broad system interfacing and allow for high-pin-count peripheral integration.
• Industrial operating range: Specified −40 °C to 100 °C operation supports reliable use in temperature-challenging environments.
• Surface-mount FCBGA package: The 2577-ball FCBGA (52.5 × 52.5 mm) provides a compact form factor for dense, high-performance system boards.
• Regulated core voltage: Defined core supply range (825 mV–876 mV) helps align power-supply design and thermal planning.

Why Choose XCVU13P-2FSGA2577I?

This Virtex® UltraScale+™ FPGA combines very large programmable logic capacity, substantial embedded memory, and a high I/O count within a 2577-ball FCBGA package, making it suitable for designs that require dense logic integration and significant on-chip storage. The device’s industrial temperature rating and RoHS compliance support deployment where environmental robustness and regulatory conformity are required.

Choose XCVU13P-2FSGA2577I for projects that need extensive on-chip resources, a high number of system I/Os, and a package compatible with high-density surface-mount assembly—backed by the architectural characteristics of the Virtex UltraScale+ family.

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