XCVU13P-3FHGA2104E

The XCVU13P-3FHGA2104E is a Virtex® UltraScale+™ field programmable gate array (FPGA) from AMD, supplied in a 2104-ball FCBGA package. It delivers very high logic capacity, abundant embedded memory and a large I/O complement for demanding, high-density programmable logic designs.

This device targets designs that require significant on-chip resources, offering approximately 3,780,000 logic elements, around 515 Mbits of embedded memory, and 832 I/O pins in a 52.5 × 52.5 mm FCBGA footprint. It is RoHS compliant and provided in an extended temperature grade with surface-mount packaging.

Key Features

• Core Logic Capacity  Approximately 3,780,000 logic elements and 216,000 configurable logic blocks (CLBs) to implement large-scale programmable logic and complex datapaths.
• Embedded Memory  Approximately 515 Mbits of on-chip RAM to support buffering, large LUT-based functions and memory-intensive algorithms without external memory.
• I/O Resources  832 available I/O pins to interface with high-pin-count systems, enabling broad connectivity and parallel data transfer.
• Power Supply  Operates from a core voltage supply range of 873 mV to 927 mV, allowing precise power provisioning for the device core.
• Package and Mounting  2104-BBGA (2104-FCBGA) package, supplier package size 52.5 × 52.5 mm; surface-mount mounting for standard PCB assembly.
• Temperature and Grade  Extended grade with an operating temperature range of 0°C to 100°C, suitable for applications within that thermal envelope.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• High-density programmable logic designs  Leverage the large logic element count and CLBs to implement complex custom logic, acceleration functions, or large-scale state machines.
• Memory-heavy algorithms  Use the approximately 515 Mbits of embedded memory to store buffers, tables, and intermediate data for signal processing and packet buffering.
• High-pin-count interface systems  832 I/O pins support broad external connectivity for multi-channel data aggregation, parallel interfaces, and dense board-level integration.

Unique Advantages

• Substantial on-chip resources: The combination of millions of logic elements and hundreds of megabits of embedded RAM reduces reliance on external components and simplifies board design.
• Large I/O complement: 832 I/Os enable direct connection to numerous peripherals and parallel interfaces, minimizing the need for external I/O expanders.
• Compact FCBGA package: The 2104-FCBGA (52.5 × 52.5 mm) package delivers high integration density in a surface-mount form factor compatible with standard assembly processes.
• Controlled core voltage range: Defined supply range (873 mV–927 mV) supports precise power management and predictable operation across the device.
• Extended temperature grade: Rated for 0°C to 100°C operation to meet designs that require operation across that thermal range.
• RoHS compliant: Conforms to lead-free manufacturing and environmental directives.

Why Choose XCVU13P-3FHGA2104E?

The XCVU13P-3FHGA2104E positions itself as a high-capacity, highly integrated FPGA solution for designs that demand extensive logic, substantial embedded memory, and broad I/O. Its package and resource mix suit complex programmable systems where consolidating functionality on-chip reduces BOM complexity and board footprint.

Manufactured by AMD and offered in a 2104-FCBGA surface-mount package with extended temperature grading and RoHS compliance, this device is appropriate for engineering teams building large-scale FPGA-based systems that need predictable core voltage operation and abundant on-chip resources.

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