XCVU13P-2FLGA2577E

The XCVU13P-2FLGA2577E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) in a 2577-FCBGA package. It provides a high logic capacity and large embedded memory, combined with extensive I/O, for applications that require dense programmable logic and on-chip storage.

This surface-mount, extended-grade device operates from a core voltage range of 825 mV to 876 mV and supports an ambient operating range of 0 °C to 100 °C, offering integration options where large logic arrays and significant on-chip RAM are required.

Key Features

• Logic Capacity  Approximately 3,780,000 logic elements to support complex, high-density designs.
• Embedded Memory  Approximately 514.9 Mbits of on-chip RAM for large data buffering and state storage.
• I/O  448 user I/O pins to enable broad external interfacing and system integration.
• Package & Mounting  2577-FCBGA (52.5 × 52.5 mm) package, surface-mount format for board-level assembly.
• Power  Specified core supply voltage from 825 mV to 876 mV to match system power domains.
• Operating Range & Grade  Extended-grade device with an operating temperature range of 0 °C to 100 °C.
• Regulatory  RoHS compliant.

Typical Applications

• High-density signal processing  Large logic element count and substantial on-chip RAM make the device suitable for complex, data-driven signal processing pipelines.
• Data buffering and packet processing  Approximately 514.9 Mbits of embedded memory supports sizable on-chip buffering and state tables for network and data-center related functions.
• Multi‑lane I/O aggregation  With 448 I/O pins, the FPGA can aggregate and route many external interfaces for system-level I/O consolidation.

Unique Advantages

• High logic density: The approximately 3,780,000 logic elements enable implementation of large, integrated designs without partitioning across multiple devices.
• Large on-chip memory: Approximately 514.9 Mbits of embedded RAM reduces dependence on external memory for many buffering and caching needs.
• Extensive I/O capability: 448 I/O pins allow flexible interfacing with multiple peripherals, sensors, or high-speed lanes.
• Compact, industry-standard package: 2577-FCBGA (52.5 × 52.5 mm) provides a high-pin-count solution in a single package for simplified board design.
• Extended-grade operating range: Rated for 0 °C to 100 °C to match elevated environmental demands within the specified range.
• RoHS compliant: Meets RoHS requirements for lead-free assembly and regulatory conformity.

Why Choose XCVU13P-2FLGA2577E?

The XCVU13P-2FLGA2577E positions itself as a high-capacity programmable logic device that combines millions of logic elements with extensive embedded memory and broad I/O. It is suited to designs that require consolidated, on-chip resources to reduce external components and simplify system architecture.

Engineers targeting large, memory-intensive, and I/O-rich designs will find the device offers scalability and integration in a single extended-grade, surface-mount FCBGA package, delivering long-term value through reduced board complexity and consolidated functionality.

Request a quote or submit an inquiry to receive pricing and availability information for the XCVU13P-2FLGA2577E.