XCVU13P-2FHGC2104I

The XCVU13P-2FHGC2104I is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC optimized for designs that require very high logic capacity and large on‑chip memory. Built in a 2104‑FCBGA package, this industrial‑grade device provides a combination of dense logic resources, extensive embedded RAM, and a high I/O count for complex programmable logic tasks.

Key attributes include millions of logic cells, approximately 515 Mbits of embedded memory, and 416 available I/O pins, making the device suitable for system prototyping, hardware acceleration, and industrial applications that require broad signal connectivity and wide operating temperatures.

Key Features

• Logic Capacity  3,780,000 logic elements provide a high-density fabric for large-scale logic implementations and complex custom architectures.
• Embedded Memory  Approximately 515 Mbits of on‑chip RAM to support large buffering, state storage, and memory‑intensive logic functions.
• I/O Resources  416 I/O pins allow extensive external interfacing for multi‑lane data paths, peripheral connectivity, and board‑level integration.
• Package  Supplied in a 2104‑FCBGA package (52.5 × 52.5 mm) for a compact, high‑pin‑count footprint suitable for surface‑mount assembly.
• Power Supply  Operates with a core voltage supply in the range of 825 mV to 876 mV, enabling designs that require a specified low‑voltage core rail.
• Temperature Range  Industrial operating temperature rating from −40 °C to 100 °C to support deployment in environments requiring extended thermal tolerance.
• Mounting & Compliance  Surface‑mount package and RoHS compliance for standard SMT assembly and environmental regulatory alignment.

Typical Applications

• System Prototyping and Hardware Acceleration  Use the device's large logic and memory resources to implement and iterate complex algorithms in hardware.
• High‑Density Logic Integration  Fit extensive customizable logic functions into a single FPGA to reduce board‑level component count.
• Multi‑Interface Systems  Leverage 416 I/O pins to connect a wide range of peripherals and high‑pin‑count interfaces on a single board.
• Industrial Controls  Deployed in systems requiring industrial temperature range and robust surface‑mount packaging.

Unique Advantages

• High Logic Density: 3.78 million logic elements enable consolidation of large designs into a single FPGA, simplifying system architecture.
• Substantial On‑Chip Memory: Approximately 515 Mbits of embedded RAM reduce reliance on external memory for buffering and state storage.
• Extensive I/O Count: 416 I/O pins provide flexibility for multi‑lane data connectivity and complex board interfaces without external multiplexing.
• Industrial Operating Range: Rated for −40 °C to 100 °C to meet the thermal requirements of many industrial deployments.
• Compact, High‑Pin Package: 2104‑FCBGA (52.5 × 52.5 mm) delivers a high pin count in a surface‑mount form factor for streamlined PCB layout.
• Regulatory Compliance: RoHS compliance supports environmentally compliant manufacturing and end products.

Why Choose XCVU13P-2FHGC2104I?

The XCVU13P-2FHGC2104I positions itself as a high‑capacity, industrial‑grade FPGA that combines millions of logic elements, large embedded memory, and a broad I/O complement in a single 2104‑FCBGA package. These attributes make it a strong option for engineers seeking to integrate substantial programmable logic and memory into compact, surface‑mount designs with extended temperature tolerance.

For design teams focused on scalability and long‑term deployment, the device offers a balance of integration and robustness: high resource counts reduce the need for multiple devices, the industrial temperature rating supports extended environmental use, and RoHS compliance aligns with environmental manufacturing requirements.

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