XCVU13P-2FHGC2104E

The XCVU13P-2FHGC2104E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC in a 2104-FCBGA package. It delivers very large programmable logic capacity and embedded memory in a surface-mount FCBGA footprint for designs that require high integration of logic, memory and I/O.

With 3,780,000 logic elements, approximately 515 Mbits of embedded memory and 416 I/O pins, this extended-grade device targets complex digital systems that need substantial on-chip resources while operating over a 0 °C to 100 °C range.

Key Features

• Programmable Logic Capacity 3,780,000 logic elements to implement large-scale custom logic, accelerators and complex state machines.
• Embedded Memory Approximately 515 Mbits of on-chip RAM to support buffering, large lookup tables and data staging without external memory.
• I/O Resources 416 available I/O pins for high-channel-count interfaces and extensive board-level connectivity.
• Package and Mounting 2104-BBGA / 2104-FCBGA package (supplier device package: 2104-FCBGA, 52.5 × 52.5 mm) in a surface-mount form factor for compact, high-density PCB layouts.
• Power Supply Range Core voltage supply specified from 0.825 V to 0.876 V, supporting defined low-voltage operation for the programmable core.
• Extended Temperature Grade Rated to operate from 0 °C to 100 °C (extended grade) for a range of commercial and demanding embedded environments.
• RoHS Compliance RoHS-compliant construction to support regulatory and manufacturing requirements.

Typical Applications

• High-density digital processing — Implements wide datapaths, custom compute pipelines and protocol engines using the device's large logic and memory resources.
• Packet processing and network interfaces — 416 I/O pins enable multi-channel interface implementations and traffic aggregation in networking equipment.
• Data buffering and on-chip memory tasks — Approximately 515 Mbits of embedded RAM supports large buffering, queuing and temporary storage without immediate reliance on external memory.
• Prototyping and complex system integration — Surface-mount FCBGA package and high logic count make the device suitable for integration into advanced prototype and production boards requiring dense functionality.

Unique Advantages

• High logic scale: 3.78 million logic elements provide the headroom to implement complex algorithms and multi-function designs on a single device.
• Large on-chip memory: Approximately 515 Mbits of embedded RAM reduce dependence on external memory and simplify board-level memory architectures.
• Substantial I/O bandwidth: 416 I/O pins enable extensive external connectivity and parallel interfacing options.
• Compact, industry-standard package: 2104-FCBGA (52.5 × 52.5 mm) balances high integration density with manufacturable surface-mount assembly.
• Defined operating range: Extended grade temperature rating (0 °C to 100 °C) and a specified core voltage range allow designers to plan power and thermal solutions with precision.
• Regulatory readiness: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose XCVU13P-2FHGC2104E?

The XCVU13P-2FHGC2104E offers a combination of very large programmable logic, extensive embedded memory and substantial I/O capacity in a single FCBGA package—making it a practical choice for designs that consolidate multiple functions onto one FPGA. Its extended temperature rating and defined core voltage range help teams design reliable systems with predictable power and thermal characteristics.

This part is suited for teams developing high-density digital processing, networking interfaces, or complex embedded systems where on-chip memory and high I/O count reduce external component needs and simplify board design. The device’s specification set supports scalable, long-lived designs that benefit from documented series-level resources and vendor-provided documentation.

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