XCVU13P-2FHGB2104I

The XCVU13P-2FHGB2104I is a Virtex® UltraScale+™ field programmable gate array (FPGA) IC designed for high-density logic and memory integration. It provides a large on-chip resource set including 3,780,000 logic elements, approximately 515 Mbits of embedded memory, and up to 702 I/O in a 2104-FCBGA package.

Specified for industrial use with an operating range of −40°C to 100°C and a core supply window of 825 mV to 876 mV, this device targets designs that require substantial logic, memory and I/O capacity in a surface-mount FCBGA form factor.

Key Features

• Logic Capacity 3,780,000 logic elements organized across 216,000 CLBs provide extensive programmable logic resources for complex designs.
• Embedded Memory Approximately 515 Mbits of on-chip RAM deliver large embedded memory for buffering, caching and state storage without external memory dependency.
• I/O Count Up to 702 user I/O pins support dense interfacing to peripherals, sensors and high-speed I/O fabrics.
• Power and Core Supply Core voltage supply range is 825 mV to 876 mV, enabling precise power design and power budgeting for the FPGA core.
• Package and Mounting 2104-FCBGA package (52.5 × 52.5 mm), surface-mount, suited for board-level integration in compact, production assemblies.
• Industrial Temperature Grade Rated for operation from −40°C to 100°C, supporting deployment in industrial temperature environments.
• Compliance RoHS compliant.

Unique Advantages

• High integration of logic and memory: 3,780,000 logic elements combined with approximately 515 Mbits of embedded RAM enable complex systems to be implemented on a single device.
• Extensive I/O connectivity: 702 I/O pins allow dense external interfacing and flexibility in system partitioning.
• Industrial operating range: −40°C to 100°C rating supports use in temperature-challenging environments.
• Compact FCBGA footprint: 2104-FCBGA (52.5 × 52.5 mm) surface-mount package provides a production-ready form factor for high-density boards.
• Controlled core supply window: 825 mV to 876 mV core voltage range assists predictable power design and regulation.
• Regulatory compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose XCVU13P-2FHGB2104I?

The XCVU13P-2FHGB2104I positions itself as a high-density Virtex® UltraScale+™ FPGA that brings together a very large logic fabric, substantial on-chip memory and abundant I/O in an industrial-grade, surface-mount FCBGA package. Its resource set is suited to designs that require significant on-chip processing, buffering and interfacing without relying solely on external components.

This device is appropriate for teams and projects focused on dense FPGA implementations that need predictable core power characteristics, wide operating temperature capability and a compact package suitable for production assemblies.

Request a quote or submit an inquiry to discuss availability, pricing and lead times for the XCVU13P-2FHGB2104I. Our team can provide the information you need to evaluate this device for your design.