XCVU13P-2FHGA2104I

The XCVU13P-2FHGA2104I is a Virtex® UltraScale+™ field programmable gate array (FPGA) IC from AMD, supplied in a 2104-BBGA FCBGA package. It delivers high logic density, extensive on-chip memory, and a large I/O count for complex programmable designs.

Key silicon resources include 216,000 CLBs, approximately 3,780,000 logic cells, approximately 515 Mbits of embedded memory, and 832 I/O pins. The device operates from 825 mV to 876 mV and is specified for an operating temperature range of -40 °C to 100 °C.

Key Features

• Core and Logic  216,000 CLBs and approximately 3,780,000 logic cells provide substantial programmable logic capacity for large designs.
• Embedded Memory  Approximately 515 Mbits of on-chip RAM to support frame buffers, FIFOs, and other memory-intensive functions.
• I/O Capability  Up to 832 I/O pins to support wide external interfaces and dense connectivity requirements.
• Package and Mounting  Delivered in a 2104-FCBGA (52.5 × 52.5 mm) package; surface mount format simplifies PCB integration for compact systems.
• Power  Specified core voltage range of 825 mV to 876 mV for the device core supply.
• Temperature and Grade  Industrial grade device rated for operation from -40 °C to 100 °C; RoHS compliant for environmental compatibility.

Unique Advantages

• High logic density: The combination of 216,000 CLBs and approximately 3,780,000 logic cells allows complex designs to be implemented on a single device, reducing board-level component count.
• Large embedded memory: Approximately 515 Mbits of on-chip RAM supports memory-heavy functionality without relying solely on external memory, simplifying BOM and layout.
• Extensive I/O: 832 I/O pins enable broad external interfacing and flexible system integration options.
• Industrial operating range: Rated from -40 °C to 100 °C to meet environmental requirements for industrial deployments.
• Robust packaging: 2104-FCBGA (52.5 × 52.5 mm) surface-mount package supports high-density board designs and reliable solder attachment.
• Regulatory compliance: RoHS compliant to support regulatory and manufacturing requirements.

Why Choose XCVU13P-2FHGA2104I?

The XCVU13P-2FHGA2104I positions itself as a high-capacity, industrial-grade FPGA suitable for designs that demand large amounts of programmable logic, substantial embedded memory, and extensive I/O. Its voltage and temperature specifications, combined with a high-pin-count FCBGA package, make it appropriate for integration into space-constrained, performance-focused systems.

Backed by AMD, this device offers the silicon resources needed to scale complex designs while keeping board-level complexity manageable. It is well suited for teams and projects that require high logic density, significant on-chip memory, and wide connectivity within an industrial temperature envelope.

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