XCVU13P-1FLGA2577E

The XCVU13P-1FLGA2577E is a Virtex UltraScale+ FPGA from AMD designed for high-density programmable logic applications. It delivers large on-chip logic and memory resources along with a high I/O count in a 2577‑FBGA package for surface‑mount system integration.

Targeted at designs that require substantial embedded memory, abundant logic elements, and many external interfaces, this device pairs significant capacity with an extended temperature grade and a defined core supply voltage range to support engineered power and thermal planning.

Key Features

• Logic Capacity  216,000 CLBs and approximately 3,780,000 logic elements provide large-scale programmable logic resources for complex designs.
• Embedded Memory  Approximately 514.9 Mbits of on‑chip RAM to support data buffering, local storage, and memory‑intensive functions.
• I/O Resources  448 user I/O pins enable a wide range of external interfacing and parallel connectivity options.
• Package  2577‑FCBGA package (2577‑BBGA) with a supplier device package size of 52.5 × 52.5 mm; designed for surface‑mount assembly.
• Power  Core voltage supply range from 825 mV to 876 mV for defined power‑delivery design.
• Temperature & Grade  Extended grade device with an operating temperature range of 0 °C to 100 °C for a variety of commercial and extended environments.
• Compliance  RoHS compliant to support regulatory and manufacturing considerations.

Typical Applications

• High‑density programmable logic  Implements large custom logic functions and state machines where high CLB and logic element counts are required.
• Memory‑intensive processing  Supports on‑chip buffering and streaming tasks using the device’s large embedded RAM capacity.
• Interface‑rich systems  Provides numerous I/O for multiport connectivity, parallel sensor interfaces, and high‑pin-count board designs.
• Prototyping and system integration  Serves as a platform for validating complex SoC and FPGA‑based designs that need significant logic and memory resources.

Unique Advantages

• Massive programmable resources: Large CLB and logic element counts reduce the need to partition designs across multiple devices.
• Substantial on‑chip memory: Approximately 514.9 Mbits of embedded RAM supports local storage and high‑throughput buffering without external memory in some designs.
• High I/O density: 448 I/O pins enable broad connectivity and simplify board‑level interface design for complex systems.
• Defined power envelope: A narrow core voltage range (825 mV–876 mV) supports precise power supply design and optimization.
• Extended operating grade: Rated for 0 °C to 100 °C operation to accommodate a range of commercial and extended environmental conditions.
• Surface‑mount FCBGA packaging: 2577‑FCBGA (52.5 × 52.5 mm) packaging provides a compact footprint for high‑density board implementations.

Why Choose XCVU13P-1FLGA2577E?

The XCVU13P-1FLGA2577E positions itself for designs that demand a combination of very large programmable logic capacity, substantial embedded memory, and a high pin count in a surface‑mount FCBGA package. Its extended grade and defined core voltage range help engineering teams plan thermal and power architectures with clear parameters.

This device is appropriate for system and hardware engineers building complex FPGA‑based solutions that require scaling of logic and memory resources while maintaining a compact board footprint. Backed by the Virtex UltraScale+ family identity, it offers a component-level option for long‑lived designs where capacity and integration matter.

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