XCVU13P-1FHGA2104I

The XCVU13P-1FHGA2104I is a Virtex® UltraScale+™ field programmable gate array (FPGA) IC from AMD. The device combines a high logic capacity with substantial on-chip memory and a large number of I/O pins in a 2104-FCBGA surface-mount package.

This industrial-grade FPGA is specified with an operating temperature range of −40 °C to 100 °C and a voltage supply range of 825 mV to 876 mV, making it suitable for designs that require significant logic resources, embedded memory, and dense I/O in a compact footprint.

Key Features

• Architecture Designated as a Virtex® UltraScale+™ FPGA as indicated by the product name.
• Logic Capacity 3,780,000 logic elements for implementing large or complex logic designs.
• Embedded Memory Approximately 514.9 Mbits of on-chip RAM for data buffering and local storage.
• I/O Connectivity 832 I/O pins to support extensive external interfacing and parallel channels.
• Power Supply Specified voltage supply range of 825 mV to 876 mV.
• Package and Mounting 2104-FCBGA package case (52.5 × 52.5 mm), surface-mount mounting for high-density assemblies.
• Temperature and Grade Industrial grade with an operating temperature range of −40 °C to 100 °C.
• Standards Compliance RoHS compliant.

Unique Advantages

• High logic density: 3,780,000 logic elements reduce the need for multiple devices when implementing large logic functions.
• Substantial on-chip memory: Approximately 514.9 Mbits of embedded RAM enables significant local data storage and buffering.
• Extensive I/O capability: 832 I/Os support high channel counts and broad peripheral interfacing without external multiplexing.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in industrial environments.
• Compact, high-density package: 2104-FCBGA (52.5 × 52.5 mm) surface-mount package integrates large resources in a single footprint.
• Manufacturer provenance: Supplied by AMD and identified as part of the Virtex UltraScale+ family.

Why Choose XCVU13P-1FHGA2104I?

The XCVU13P-1FHGA2104I positions itself for designs that require a combination of very large logic capacity, substantial embedded RAM, and a high I/O count in an industrial-grade FPGA. Its specified voltage range, RoHS compliance, and surface-mount 2104-FCBGA package make it suitable for compact, resource-intensive applications that must operate across a wide temperature range.

As a Virtex® UltraScale+™ device from AMD, the part provides a single-device option for consolidating complex logic, memory, and I/O needs, helping to simplify board-level design and procurement for projects that match the device’s specifications.

Request a quote or submit a purchase inquiry to receive pricing and availability for the XCVU13P-1FHGA2104I.