XCVU125-2FLVC2104I

The XCVU125-2FLVC2104I is a Virtex® UltraScale™ Field Programmable Gate Array IC from AMD, supplied in a 2104-FCBGA package. It provides a high logic density architecture with a large amount of embedded RAM and a broad set of I/O pins, targeted to industrial applications that require substantial on-chip resources and robust operating conditions.

With approximately 1,566,600 logic elements and roughly 90.7 Mbits of embedded memory, this FPGA is designed for designs that demand dense logic integration, significant on-chip storage, and a high pin count within a surface-mount FCBGA footprint.

Key Features

• Core Logic  Approximately 1,566,600 logic elements to support large, complex designs and parallel processing implementations.
• Embedded Memory  Approximately 90.7 Mbits of on-chip RAM for buffering, frame storage, and data-path implementations.
• I/O Capacity  416 general-purpose I/O pins to support wide interfacing with peripherals, memory, and high-speed I/O subsystems.
• Package & Mechanical  2104-FCBGA package (47.5 × 47.5 mm) in a surface-mount format for high-density board integration.
• Power  Core supply voltage range specified at 922 mV to 979 mV.
• Operating Conditions & Compliance  Industrial-grade device rated for operation from −40 °C to 100 °C and RoHS compliant.

Typical Applications

• Industrial Control & Automation  Industrial-grade temperature range and high logic density enable complex control logic and real-time processing in harsh environments.
• High-Density Logic & Signal Processing  Large logic element count and substantial embedded memory support signal processing pipelines and parallel compute tasks.
• Memory-Intensive Embedded Systems  Approximately 90.7 Mbits of on-chip RAM provides local storage for buffering, look-up tables, and data path staging.

Unique Advantages

• High Logic Density: Approximately 1,566,600 logic elements reduce the need for multi-device implementations and simplify board-level integration.
• Significant On-Chip Memory: Roughly 90.7 Mbits of embedded RAM supports large buffers and data-centric architectures without relying solely on external memory.
• Extensive I/O: 416 I/O pins accommodate broad peripheral connectivity and multi-channel interfaces directly on the FPGA.
• Industrial Temperature Rating: −40 °C to 100 °C operating range suits deployments requiring extended environmental tolerance.
• Compact FCBGA Form Factor: 2104-FCBGA (47.5 × 47.5 mm) enables dense PCB implementations while preserving device capability.
• Low-Voltage Core: Core supply specified between 922 mV and 979 mV for designs targeting modern low-voltage power domains.

Why Choose XCVU125-2FLVC2104I?

The XCVU125-2FLVC2104I combines significant logic capacity, large embedded memory, and a high I/O count in a single industrial-grade FCBGA package, making it well suited for complex, memory-heavy FPGA designs that must operate reliably across a wide temperature range. Its specification set is focused on integration density and robust operation for demanding embedded and industrial applications.

Backed by AMD’s Virtex® UltraScale™ family pedigree, this device is appropriate for engineering teams requiring scalable logic resources, substantial on-chip RAM, and a compact surface-mount package for production designs.

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