XCVU125-2FLVB1760I

The XCVU125-2FLVB1760I is a Virtex® UltraScale™ field programmable gate array (FPGA) IC designed for industrial applications requiring high logic density and substantial on-chip memory. This surface-mount, industrial‑grade FPGA integrates 1,566,600 logic elements and approximately 90.7 Mbits of embedded memory to support complex, compute‑intensive designs.

With 702 I/O pins, a 1760‑FCBGA package (42.5 × 42.5 mm), and an operating temperature range of −40 °C to 100 °C, the device is targeted at system designs that need dense logic resources, large embedded RAM capacity, and robust thermal range in a compact FCBGA footprint.

Key Features

• High Logic Density  Provides 1,566,600 logic elements for implementing large-scale digital designs and complex processing pipelines.
• Embedded Memory  Approximately 90.7 Mbits of on-chip RAM to support buffering, lookup tables, and data storage within the FPGA fabric.
• I/O Capacity  702 user I/O pins to accommodate wide parallel interfaces, multiple external peripherals, and flexible board-level connectivity.
• Power Supply Range  Core voltage supply range of 922 mV to 979 mV, enabling designers to match power delivery to the device requirements.
• Package and Mounting  1760‑BBGA / 1760‑FCBGA package with supplier dimensions 42.5 × 42.5 mm; surface-mount mounting type for compact PCB integration.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to meet industrial temperature requirements.
• Standards Compliance  RoHS compliant for regulatory and environmental considerations.

Typical Applications

• High‑density digital processing  Use the device where large numbers of logic elements and embedded RAM are required to implement complex data-paths and custom accelerators.
• Multi‑interface systems  Leverage 702 I/O pins to interface with multiple external devices, sensors, or parallel buses in a single FPGA solution.
• Industrial control and automation  Deploy in industrial equipment designs that require an extended operating temperature range and a compact FCBGA package.

Unique Advantages

• Significant on‑chip resources: The combination of 1,566,600 logic elements and ~90.7 Mbits of embedded memory reduces dependence on external logic and RAM components.
• Flexible I/O integration: 702 I/O pins enable broad connectivity options, simplifying board-level routing and peripheral integration.
• Industrial temperature range: Guaranteed operation from −40 °C to 100 °C supports robust performance in a wide range of environments.
• Compact, high‑pin package: 1760‑FCBGA (42.5 × 42.5 mm) provides a high-pin-count solution in a space-efficient form factor for dense system designs.
• Regulatory compliance: RoHS compliance supports environmental and materials requirements for many deployable systems.

Why Choose XCVU125-2FLVB1760I?

The XCVU125-2FLVB1760I positions itself as a high‑capacity FPGA solution that balances extensive logic resources and substantial embedded memory with a high I/O count and industrial temperature capability. It is well suited for engineers developing dense digital systems, multi‑interface platforms, and industrial applications where on‑chip resources and robust thermal performance matter.

For designs that demand scalability and integration while maintaining a compact FCBGA footprint, this Virtex® UltraScale™ device offers a clear resource profile to evaluate during system architecture and component selection.

Request a quote or contact sales to obtain pricing, availability, and additional technical support for the XCVU125-2FLVB1760I.