XCVU125-2FLVA2104I

The XCVU125-2FLVA2104I is a Virtex® UltraScale™ Field Programmable Gate Array (FPGA) IC by AMD, packaged in a 2104-BBGA FCBGA (2104-FCBGA, 47.5×47.5 mm) surface-mount package. It is specified as industrial grade and RoHS compliant.

With approximately 1,566,600 logic elements, roughly 90.7 Mbits of embedded on-chip RAM and up to 832 I/O, this device addresses designs that require high logic density, substantial embedded memory, and extensive I/O capability while operating across an extended temperature range of −40 °C to 100 °C and a core supply range of 922 mV to 979 mV.

Key Features

• Core Logic  Approximately 1,566,600 logic elements provide large-scale programmable logic capacity for complex, custom digital designs.
• Embedded Memory  Approximately 90.7 Mbits of on-chip RAM available for buffering, state storage and data-path operations without external SRAM/DRAM dependency.
• I/O Capacity  Up to 832 I/O pins to support wide buses, multi-channel interfaces and extensive peripheral connectivity.
• Power Supply Range  Core voltage supply specified between 922 mV and 979 mV for integration with regulated power-rail designs.
• Package & Mounting  2104-BBGA, FCBGA package (supplier device package: 2104-FCBGA, 47.5×47.5 mm) optimized for surface-mount assembly and high routing density.
• Thermal & Grade  Industrial grade component with an operating temperature range of −40 °C to 100 °C for deployment in extended-temperature environments.
• Regulatory Compliance  RoHS compliant for conformity with common environmental requirements.

Typical Applications

• High-density logic systems  Use where nearly 1.57M logic elements are required to implement complex, large-scale digital functions and custom hardware accelerators.
• Memory-intensive designs  Leverage approximately 90.7 Mbits of embedded memory for on-chip buffering, look-up tables and state retention without relying solely on external memory.
• I/O-rich interfaces  Deploy in systems demanding many external connections—up to 832 I/O—such as multi-channel data acquisition or aggregated bus interfaces.
• Industrial deployments  Industrial grade specification and −40 °C to 100 °C operation support extended-temperature installations and ruggedized environments.

Unique Advantages

• Highly integrated logic and memory: Combines approximately 1.57M logic elements with ~90.7 Mbits of embedded RAM for dense, self-contained designs that reduce external component count.
• Extensive I/O scalability: Up to 832 I/O pins enable broad connectivity options for complex multi-channel or high-pin-count interfaces.
• Industrial temperature capability: Rated from −40 °C to 100 °C to meet requirements for extended-temperature and industrial applications.
• Large FCBGA package: 2104-FCBGA (47.5×47.5 mm) package supports high routing density and signal distribution for advanced board-level implementations.
• Controlled core supply window: Clearly defined voltage range (922 mV to 979 mV) simplifies power-rail planning and integration with regulated power designs.
• RoHS compliance: Meets common environmental standards to simplify regulatory management across supply chains.

Why Choose XCVU125-2FLVA2104I?

The XCVU125-2FLVA2104I positions itself as a high-capacity Virtex UltraScale FPGA option for engineers who require a combination of very large programmable logic resources, substantial on-chip RAM and a high I/O count in an industrial-grade package. Its specified operating range and compact FCBGA footprint make it suitable for applications where on-board integration density and extended-temperature operation are important.

Designed for complex, scalable designs, this AMD-manufactured FPGA delivers verifiable capacity and environmental specifications so procurement and design teams can plan around concrete logic, memory, I/O and thermal numbers for long-term deployments.

Request a quote or submit a procurement inquiry to receive pricing and availability for the XCVU125-2FLVA2104I.